IP Library Granted Patent US 8,835,761
Granted Patent B2
US 8,835,761 · App. 12/602,979 · Granted Sep 16, 2014

Sealing structure

Inventors: Takahiro Hayashi (Fujisawa, JP); Makoto Hora (Fujisawa, JP); Keiichi Miyajima (Fujisawa, JP)
Assignee: NOK Corporation
H05K1/028H05K2201/09663H05K2203/1147
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Quick Facts
Patent No.
US 8,835,761
App. No.
12/602,979
Granted
Sep 16, 2014
Kind
B2
Abstract

To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.

Claims (25)

1. A sealing structure comprising:

a housing;

a flexible wiring board penetrating through the housing; and

a sealing member bonded to said flexible wiring board so as to be integral therewith, and provided to airtightly seal a gap between said housing and said flexible wiring board,

wherein said flexible wiring board includes:

a base substrate made of an elastic material;

an electrically conductive printed wiring layer formed on a surface of said base substrate; and

a cover film covering a surface of said printed wiring layer,

wherein said flexible wiring board includes a region which comes under thermal influence when said seal member is integrally bonded to said flexible wiring board,

wherein said printed wiring layer, which crosses said sealing member, is formed as a first single printed wiring layer that is divided direct into a plurality of divided print wiring layers that are recombined directly into a second single printed wiring layer,

wherein each of the plurality of divided wiring layers is electrically connected to the first and second single printed wring layers, and

wherein the divided print wiring layers are only provided in an entirety of the region which comes under the thermal influence, and the region includes a crossing region with said sealing member.

2. The sealing structure as claimed in claim 1 , wherein a plurality of said printed wiring layers are provided, and each of the printed wiring layers is formed as a plurality of divided print wiring layers.

3. The sealing structure as claimed in claim 2 , wherein said divided print wiring layers are divided equally.

4. The sealing structure as claimed in claim 2 , wherein the total sectional area of said divided print wiring layers is substantially the same as that of said printed wiring layer.

5. The sealing structure as claimed in claim 2 , wherein said flexible wiring board has a multilayered structure.

6. The sealing structure as claimed in claim 2 , wherein said sealing member is formed as a frame-shaped seal to simultaneously seal a gap between the housing and a gap between the housing and the flexible wiring board.

7. The sealing structure as claimed in claim 2 , wherein said sealing member is formed as a bush-shaped seal to seal a gap between an insertion hole provided in said housing and the flexible wiring board.

8. The sealing structure as claimed in claim 2 , wherein said sealing member is formed in a combined structure of a frame-shaped seal to simultaneously seal a gap between the housings and a gap between the housing and the flexible wiring board and a bush-shaped seal to seal a gap between an insertion hole provided in said housing and the flexible wiring board.

9. The sealing structure as claimed in claim 1 , wherein said divided print wiring layers are divided equally.

10. The sealing structure as claimed in claim 1 , wherein the total sectional area of said divided print wiring layers is substantially the same as that of said printed wiring layer.

11. The sealing structure as claimed in claim 1 , wherein said flexible wiring board has a multilayered structure.

12. The sealing structure as claimed in claim 1 , wherein said sealing member is formed as a frame-shaped seal to simultaneously seal a gap between the housing and a gap between the housing and the flexible wiring board.

13. The sealing structure as claimed in claim 1 , wherein said sealing member is formed as a bush-shaped seal to seal a gap between an insertion hole provided in said housing and the flexible wiring board.

14. The sealing structure as claimed in claim 1 , wherein said sealing member is formed in a combined structure of a frame-shaped seal to simultaneously seal a gap between the housing and a gap between the housing and the flexible wiring board and a bush-shaped seal to seal a gap between an insertion hole provided in said housing and the flexible wiring board.

Assignments (3)
CHANGE OF NAME Recorded Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2019
From: NOK CORPORATION
To: NIPPON MEKTRON, LTD.
Reel/Frame 047994/0485 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2009
From: HAYASHI, TAKAHIRO; HORA, MAKOTO; MIYAJIMA, KEIICHI
To: NOK CORPORATION
Reel/Frame 023602/0560 →
Priority Claims (1)
JP 2007-248845 · Sep 26, 2007 · national
Continuity (1)
Related Publication 20100181089A1 · Jul 22, 2010