Flexible printed circuit board and manufacturing method of flexible printed circuit board
A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL 2 , and the solid ground layers are arranged on an inner peripheral side of the curved portions.
1. A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, insulating layers covering the signal line from both sides and each made of a thermoplastic resin as its material, and a pair of ground layers facing the signal line with the respective insulating layers sandwiched therebetween, the flexible printed circuit board comprising
a pleated part having curved portions molded at a plurality of positions thereof, the curved portions being curved so as to be opened or closed,
in the ground layers, mesh ground layers in which conductive portions exist to surround openings so that the conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided,
the mesh ground layers are arranged on an outer peripheral side of the curved portions, and the solid ground layers are arranged on an inner peripheral side of the curved portions.
2. The flexible printed circuit board according to claim 1 , wherein:
directions of curves of the curved portions are alternately switched to provide the pleated part to have a bellows shape; and
the mesh ground layers are arranged on the outer peripheral side of the curved portions in a state of existing on a front surface side and a rear surface side of the signal line, in an alternate manner.
3. The flexible printed circuit board according to claim 2 , wherein
the insulating layer is formed by using LCP (Liquid Crystal Polymer) being the thermoplastic resin as its material.
4. The flexible printed circuit board according to claim 2 , wherein
a plating coating film for interlayer connection is not formed on the ground layers positioned at the curved portions.
5. The flexible printed circuit board according to claim 1 , wherein:
directions of curves of the curved portions are alternately switched to provide the pleated part to have a bellows shape; and
the mesh ground layers are arranged on the outer peripheral side of the curved portions in a state of existing on either a front surface side or a rear surface side of the signal line.
6. The flexible printed circuit board according to claim 5 , wherein
the insulating layer is formed by using LCP (Liquid Crystal Polymer) being the thermoplastic resin as its material.
7. The flexible printed circuit board according to claim 5 , wherein
a plating coating film for interlayer connection is not formed on the ground layers positioned at the curved portions.
8. The flexible printed circuit board according to claim 1 , wherein
the insulating layer is formed by using LCP (Liquid Crystal Polymer) being the thermoplastic resin as its material.
9. The flexible printed circuit board according to claim 1 , wherein
a plating coating film for interlayer connection is not formed on the ground layers positioned at the curved portions.
10. A manufacturing method of a flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, insulating layers covering the signal line from both sides and each made of a thermoplastic resin as its material, and a pair of ground layers facing the signal line with the respective insulating layers sandwiched therebetween, the manufacturing method of the flexible printed circuit board comprising:
a first step of forming at least one of the signal line on, in a double-sided copper-clad laminate having base copper foil layers on both surfaces of the insulating layer, the base copper foil layer of one surface side;
a second step of laminating, via a lamination adhesive material, a single-sided copper-clad laminate having a base copper-clad laminate on one side of the insulating layer;
a third step of forming through holes on predetermined portions of an intermediate product formed through the second step;
a fourth step of forming conductive through holes by forming conductive coating films on the through holes and a periphery of openings of the through holes;
a fifth step of performing patterning on the base copper foil layers facing the signal line in an intermediate product formed through the fourth step, to form, on a side of either one surface, mesh ground layers in which conductive portions exist to surround openings, and to form, on a side of surface opposite to the one surface, solid ground layers in which the conductive portions are provided in a planar state;
a sixth step of covering at least curved portions to be curved after performing heat-molding, in the mesh ground layers and the solid ground layers, with insulating resin layers via adhesive material layers; and
a seventh step of performing, on a flexible printed circuit board before being subjected to the heat-molding formed through the sixth step, the heat-molding in a state where a plurality of portions are curved, and forming, after the heat-molding, a pleated part in which a plurality of curved portions having the mesh ground layers positioned on an outer peripheral side thereof exist.