Laser processing method and production method of multilayer flexible printed wiring board using laser processing method
There is provided a laser processing method of forming via holes 23 and 24 by removing processed layers including a flexible insulating base member 1 , in which conformal masks 7 and 8 a are provided on the surface, and an adhesive layer 12 having a higher absorbance in a wavelength area of processing laser and a lower decomposition temperature than the insulating base member 1 , the method including radiating one shot of pulse light having a first energy density that can remove the insulating base member 1 by one shot without causing the deformation and penetration of a conducting film 2 A, and subsequently radiating pulse light having a second energy density that is lower than the first energy density and can remove the rest of the processed layers by a predetermined number of shots without causing the deformation and penetration of the conducting film 2 A.
1. A laser processing method of forming a via hole in a structure that includes a first insulating layer, a second insulating layer, and a conductive film, wherein
the conductive film defines a bottom of the via hole,
the first insulating layer is provided with a first conformal mask on a top surface thereof and is characterized by a first absorbance at an operational wavelength of a pulsed laser and by a first decomposition temperature, wherein the value of the operational wavelength is one selected from one or more wavelength values that allow for functional operation of the pulsed laser, and
the second insulating layer is provided below the first insulating layer and is characterized by a second absorbance that is higher than the first absorbance at the operational wavelength and by a second decomposition temperature that is lower than the first decomposition temperature,
the method comprising:
a first irradiation step of radiating one shot of a first light from the pulsed laser onto the structure to completely remove a portion of the first insulating layer that is exposed by a mask hole of the first conformal mask, a first energy density of the first light being selected so that the conductive film is not deformed or penetrated by the one shot of the first light; and
a second irradiating step of radiating a predetermined number of shots of a second light from the pulsed laser onto the structure to remove a portion of the second insulating layer that is below the completely removed portion of the first insulating layer so as to form the via hole, the second light having a second energy density that is lower than the first energy density and the second energy density being selected so that the conductive film is not deformed or penetrated by the predetermined number of shots of the second light.
2. The laser processing method according to claim 1 , wherein the structure further includes a third insulating layer and a fourth insulating layer,
the third insulating layer is provided below the second insulating layer and is characterized by a third absorbance at the operational wavelength and by a third decomposition temperature,
the fourth insulating layer is provided below the third insulating layer and on the conductive film and is characterized by a fourth absorbance that is higher than the third absorbance at the operational wavelength and by a fourth decomposition temperature that is lower than the third decomposition temperature, and
the third insulating layer and the fourth insulating layer are removed by the second light having the second energy density.
3. The laser processing method according to claim 2 , wherein the via hole is a step via hole that is constituted by an upper hole and a lower hole and the first insulating layer is further provided with a second conformal mask on a bottom surface thereof,
the second conformal mask being a patterned conductive film that is used to form the lower hole of the step via hole, and
the step via hole being formed as a result of the first and second irradiation steps, wherein the value of each of the first energy density and the second energy density is selected so that the second formal mask is not deformed or penetrated by the one shot of the first light and the predetermined number of shots of the second light.
4. The laser processing method according to claim 3 , wherein a ratio of the second energy density to the first energy density is from 1:4 to 2:3.
5. The laser processing method according to claim 4 , wherein
the first insulating layer is comprised of a polyimide or a liquid crystal polymer,
the second insulating layer is comprised of an epoxy adhesive or an acrylic adhesive, and
the pulsed laser is a carbon dioxide laser.
6. A production method of a multilayer flexible printing wiring board that is comprised of a via for interlayer connection, wherein said via is formed by:
forming a via hole in accordance with the laser processing method of claim 5 ;
performing plating processing to form a plated layer on at least one wall that defines the via hole.
7. The laser processing method according to claim 2 , wherein
the first insulating layer is comprised of a polyimide or a liquid crystal polymer,
the second insulating layer is comprised of an epoxy adhesive or an acrylic adhesive, and
the pulsed laser is a carbon dioxide laser.
8. A production method of a multilayer flexible printing wiring board that is comprised of a via for interlayer connection, wherein said via is formed by:
forming a via hole in accordance with the laser processing method of claim 7 ;
performing plating processing to form a plated layer on at least one wall that defines the via hole.
9. The laser processing method according to claim 1 , wherein the via hole is a step via hole that is constituted by an upper hole and a lower hole and the first insulating layer is further provided with a second conformal mask on a bottom surface thereof,
the second conformal mask being a patterned conductive film that is used to form the lower hole of the step via hole, and
the step via hole being formed as a result of the first and second irradiation steps, wherein the value of each of the first energy density and the second energy density is selected so that the second formal mask is not deformed or penetrated by the one shot of the first light and the predetermined number of shots of the second light.
10. The laser processing method according to claim 9 , wherein a ratio of the second energy density to the first energy density is from 1:4 to 2:3.
11. The laser processing method according to claim 9 , wherein
the first insulating layer is comprised of a polyimide or a liquid crystal polymer,
the second insulating layer is comprised of an epoxy adhesive or an acrylic adhesive, and
the pulsed laser is a carbon dioxide laser.
12. A production method of a multilayer flexible printing wiring board that is comprised of a via for interlayer connection, wherein said via is formed by:
forming a via hole in accordance with the laser processing method of claim 11 ;
performing plating processing to form a plated layer on at least one wall that defines the via hole.
13. The laser processing method according to claim 1 , wherein
the first insulating layer is comprised of a polyimide or a liquid crystal polymer,
the second insulating layer is comprised of an epoxy adhesive or an acrylic adhesive; and
the pulsed laser is a carbon dioxide laser.
14. A production method of a multilayer flexible printing wiring board that is comprised of a via for interlayer connection, wherein said via is formed by:
forming a via hole in accordance with the laser processing method of claim 13 ;
performing plating processing to form a plated layer on at least one wall that defines the via hole.
15. A production method of a multilayer flexible printing wiring board that is comprised of a via for interlayer connection, wherein said via is formed by:
forming a via hole in accordance with the laser processing method of claim 1 ;
performing plating processing to form a plated layer on at least one wall that defines the via hole.