IP Library Granted Patent US 9,034,535
Granted Patent B2
US 9,034,535 · App. 13/697,151 · Granted May 19, 2015

Flexible circuit board and method for manufacturing the same, and fuel cell using the flexible circuit board

Inventor: Masanori Hirata (Ushiku, JP)
Assignee: NIPPON MEKTRON, LTD
H01M8/0269H01M8/0276H01M8/0271H01M8/1011H01M8/0206H01M8/0228Y02E60/50
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Quick Facts
Patent No.
US 9,034,535
App. No.
13/697,151
Granted
May 19, 2015
Kind
B2
Abstract

There is provided a flexible circuit board capable of preventing corrosion and elution of a conductor layer constituting a current collector even under high-temperature and high-voltage working conditions while achieving sufficient electric connection with an MEA. A flexible circuit board having a current collector of a fuel cell provided thereon includes an insulating flexible base material 1 , a plurality of openings 5 that supply fuel or air, the openings 5 being provided in a specified region so as to penetrate through the flexible base material 1 in a thickness direction, a plating film 6 that constitutes the current collector, the plating film 6 being formed on front and back surfaces of the flexible base material 1 in the specified region and on inner walls of the openings 5 , a surface treatment film 9 formed on the plating film 6 and having corrosion resistance higher than that of the plating film.

Claims (24)

1. A flexible circuit board having a current collector of a fuel cell provided thereon, comprising:

an insulating flexible base material;

a plurality of openings that supply fuel or air, the openings being provided in a specified region so as to penetrate through the flexible base material in a thickness direction;

a conductor layer that constitutes the current collector, the conductor layer being formed on a front surface and a back surface of the flexible base material in the specified region and on inner walls of the plurality of openings;

a conductive surface treatment film formed on top of the conductor layer, the conductive surface treatment film having corrosion resistance higher than that of the conductor layer; and

an insulating layer that covers the surface treatment film in a peripheral edge portion of the current collector across a boundary of the current collector.

2. The flexible circuit board according to claim 1 , wherein

the conductor layer is made of copper (Cu), and

the surface treatment film is a plating film made of gold (Au), platinum (Pt), or titanium (Ti).

3. The flexible circuit board according to claim 2 , wherein

the surface treatment film has a nickel (Ni) plating film as a base.

4. The flexible circuit board according to claim 2 , further comprising

an extraction electrode extending from the current collector along with the flexible base material.

5. A fuel cell comprising:

a Membrane Electrode Assembly (MEA) constituted of an electrolyte membrane, a fuel electrode bonded to one surface of the electrolyte membrane, and an air electrode bonded to the other surface of the electrolyte membrane; and

a flexible circuit board according to claim 4 , the flexible circuit board being disposed so that the current collector is in contact with the fuel electrode or the air electrode.

6. A fuel cell comprising:

a Membrane Electrode Assembly (MEA) constituted of an electrolyte membrane, a fuel electrode bonded to one surface of the electrolyte membrane, and an air electrode bonded to the other surface of the electrolyte membrane; and

a flexible circuit board according to claim 2 , the flexible circuit board being disposed so that the current collector is in contact with the fuel electrode or the air electrode.

7. The flexible circuit board according to claim 1 , further comprising

an extraction electrode extending from the current collector along with the flexible base material.

8. A fuel cell comprising:

a Membrane Electrode Assembly (MEA) constituted of an electrolyte membrane, a fuel electrode bonded to one surface of the electrolyte membrane, and an air electrode bonded to the other surface of the electrolyte membrane; and

a flexible circuit board according to claim 1 , the flexible circuit board being disposed so that the current collector is in contact with the fuel electrode or the air electrode.

Assignments (2)
CHANGE OF NAME Recorded Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2012
From: HIRATA, MASANORI
To: NIPPON MEKTRON, LTD.
Reel/Frame 029272/0030 →
Priority Claims (1)
JP 2011-139589 · Jun 23, 2011 · national
Continuity (1)
Related Publication 20130202985A1 · Aug 8, 2013