Adhesive composition using polyamide-imide resin
The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250° C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25° C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.
1. An adhesive composition comprising a polyamide-imide resin, an epoxy resin, and a phosphorus-containing flame retardant,
wherein the polyamide-imide resin comprises a constitution unit derived from a polycarboxylic acid having an aromatic group as an acid ingredient, wherein a rate thereof in the total acid ingredient is 90 mol % or higher, and the polyamide-imide resin does not comprise acrylonitrile-butadiene rubber as a polymerization component, and
wherein the adhesive composition has the following characteristics (A) to (F):
(A) 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin;
(B) a glass transition temperature of the polyamide-imide resin is 250° C. or higher;
(C) an acid value of the polyamide-imide resin is 50 to 150 mg KOH/g;
(D) the epoxy resin is liquid at 25° C.;
(E) 400/21 to 60 parts by mass of the phosphorus-containing flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and
(F) 50% by mass or more of the phosphorus-containing flame retardant is 10-benzyl-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide.
2. The adhesive composition according to claim 1 , wherein the polyamide-imide resin having an aromatic group as an acid ingredient is trimellitic acid anhydride.
3. The adhesive composition according to claim 1 , wherein the adhesive composition is used for adhering a copper foil with a polyimide film.
4. The adhesive composition according to claim 1 , wherein the rate of the constitution unit derived from the polycarboxylic acid having an aromatic group in the total acid ingredient is 100 mol %.
5. A copper foil equipped with an adhesive layer, wherein the adhesive layer comprises the adhesive composition according to claim 1 .
6. The copper foil equipped with the adhesive layer according to claim 5 , wherein an amount of residual solvent in the adhesive layer of the copper foil equipped with the adhesive layer in a state of B stage is 5.0 to 16.0% by mass.
7. The copper foil equipped with the adhesive layer according to claim 5 , wherein the foil can be laminated at a laminating temperature of 150° C. or lower.
8. A double-sided flexible copper-clad laminate, wherein the laminate is prepared by adhering the copper foil equipped with the adhesive layer according to claim 5 to each side of a polyimide film.
9. A flexible printed wiring board, comprising the double-sided flexible copper-clad laminate according to claim 8 .