IP Library Assignment 045962/0428
Patent Assignment
Reel/Frame 045962/0428

Assignment of Assignor's Interest

Recorded: 2018-06-01 Pages: 4
Assignors
YANE, TAKEHISA
Executed: 2018-04-13
KOYANAGI, HIDEYUKI
Executed: 2018-04-13
OHRUI, MANABU
Executed: 2018-04-13
EBIHARA, SATOSHI
Executed: 2018-04-13
Assignees
TOYOBO CO., LTD.
2-8, DOJIMA HAMA 2-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 530-8230, JAPAN
NIPPON MEKTRON, LTD.
1-12-15, SHIBA-DAIMON, MINATO-KU, TOKYO, 105-8585, JAPAN
Covered Property (1)
Adhesive Composition Using Polyamide-Imide Resin
Application: 15/780,739 →
Publication: US 2018/0362815
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO CO., LTD.
Reel/Frame 064505/0124 →
De-Merger Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO MC CORPORATION
Reel/Frame 064505/0803 →
Change of Name Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →