Flexible circuit board and its method for production
A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.
1. A flexible circuit board comprising:
an insulating film made of a thermoplastic resin;
a wiring layer formed on said insulating film; and
an insulating layer made of a thermoplastic resin and formed on said wiring layer;
wherein a spiral part shaped into a spiral shape is formed in at least a part of said flexible circuit board;
said spiral part is shaped in such a manner that a part of a circumferential surface and another adjacent part of the circumferential surface mutually overlap with each other;
said spiral part is shaped in an arc shaped portion which is formed in said flexible circuit board in a state where said spiral part has not been shaped; and
said flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in said spiral part.
2. The flexible circuit board as set forth in claim 1 , wherein said thermoplastic resin is a liquid crystal polymer.
3. The flexible circuit board as set forth in claim 2 , wherein
said wiring layer is formed on opposite side surfaces of said insulating film;
said wiring layer formed on one side surface of said insulating film is used as a signal line for signal transmission; and
said wiring layer formed on the other side surface of said insulating film is used as a power line for supplying electric power.
4. The flexible circuit board as set forth in claim 2 , wherein
said wiring layer is formed on opposite side surfaces of said insulating film;
said wiring layer formed on one side surface of said insulating film is used as at least one of a signal line for signal transmission and a power line for supplying electric power;
said wiring layer formed on the other side surface of said insulating film is used as a ground pattern; and
in said spiral part, said other side surface is arranged at an outer peripheral side more outside than said one side surface.
5. The flexible circuit board as set forth in claim 2 , wherein said spiral part is constructed in such a manner that another wiring is able to pass through its hollow interior portion.
6. The flexible circuit board as set forth in claim 2 , wherein said spiral part is formed by a method comprising:
winding said flexible circuit board around a shaping device of a circular column shape in a state in which tension is applied to opposite ends of said flexible circuit board in a first step; and
heating that portion of said flexible circuit board which is wound around said shaping device to shape said spiral part in said flexible circuit board in a second step.
7. The flexible circuit board as set forth in claim 1 , wherein
said wiring layer is formed on opposite side surfaces of said insulating film;
said wiring layer formed on one side surface of said insulating film is used as a signal line for signal transmission; and
said wiring layer formed on the other side surface of said insulating film is used as a power line for supplying electric power.
8. The flexible circuit board as set forth in claim 7 , wherein said spiral part is constructed in such a manner that another wiring is able to pass through its hollow interior portion.
9. The flexible circuit board as set forth in claim 7 , wherein said spiral part is formed by a method comprising:
winding said flexible circuit board around a shaping device of a circular column shape in a state in which tension is applied to opposite ends of said flexible circuit board in a first step; and
heating that portion of said flexible circuit board which is wound around said shaping device to shape said spiral part in said flexible circuit board in a second step.
10. The flexible circuit board as set forth in claim 1 , wherein
said wiring layer is formed on opposite side surfaces of said insulating film;
said wiring layer formed on one side surface of said insulating film is used as at least one of a signal line for signal transmission and a power line for supplying electric power;
said wiring layer formed on the other side surface of said insulating film is used as a ground pattern; and
in said spiral part, said other side surface is arranged at an outer peripheral side more outside than said one side surface.
11. The flexible circuit board as set forth in claim 10 , wherein said spiral part is constructed in such a manner that another wiring is able to pass through its hollow interior portion.
12. The flexible circuit board as set forth in claim 10 , wherein said spiral part is formed by a method comprising:
winding said flexible circuit board around a shaping device of a circular column shape in a state in which tension is applied to opposite ends of said flexible circuit board in a first step; and
heating that portion of said flexible circuit board which is wound around said shaping device to shape said spiral part in said flexible circuit board in a second step.
13. The flexible circuit board as set forth in claim 1 , wherein said spiral part is constructed in such a manner that another wiring is able to pass through its hollow interior portion.
14. The flexible circuit board as set forth in claim 13 , wherein said spiral part is formed by a method comprising:
winding said flexible circuit board around a shaping device of a circular column shape in a state in which tension is applied to opposite ends of said flexible circuit board in a first step; and
heating that portion of said flexible circuit board which is wound around said shaping device to shape said spiral part in said flexible circuit board in a second step.
15. The flexible circuit board as set forth in claim 1 , wherein said spiral part is formed by a method comprising:
winding said flexible circuit board around a shaping device of a circular column shape in a state in which tension is applied to opposite ends of said flexible circuit board in a first step; and
heating that portion of said flexible circuit board which is wound around said shaping device to shape said spiral part in said flexible circuit board in a second step.
16. The flexible circuit board as set forth in claim 15 , wherein
said thermoplastic resin is a liquid crystal polymer;
in said second step, a heating temperature is a temperature at which a surface temperature of said flexible circuit board becomes equal to or higher than 150 degrees C. and less than a thermal deformation starting temperature of the liquid crystal polymer; and
a heating time is within 1 hour.
17. A method for production of a flexible circuit board comprising:
an insulating film made of a thermoplastic resin;
a wiring layer formed on said insulating film; and
an insulating layer made of a thermoplastic resin and formed on said wiring layer, and
wherein:
a spiral part shaped into a spiral shape is formed in at least a part of said flexible circuit board; and
said flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in said spiral part;
said method for production of a flexible circuit board being characterized by comprising:
a first step to wind said flexible circuit board around a shaping device of a circular column shape in a state in which tension is applied to opposite ends of said flexible circuit board; and
a second step to heat that portion in said flexible circuit board which is wound around said shaping device, thereby to shape said spiral part in said flexible circuit board;
wherein said thermoplastic resin is a liquid crystal polymer;
wherein in said second step, a heating temperature is a temperature at which a surface temperature of said flexible circuit board becomes equal to or higher than 150 degrees C. and less than a thermal deformation starting temperature of the liquid crystal polymer; and
wherein in said second step, a heating time is within 1 hour.