IP Library Granted Patent US 9,235,011
Granted Patent B2
US 9,235,011 · App. 13/566,145 · Granted Jan 12, 2016

Optical and electrical mixed flexible printed wiring board and method of mounting light receiving/emitting device thereof

Inventors: Shoji Takano (Minato-Ku, JP); Fumihiko Matsuda (Minato-Ku, JP)
Assignee: Nippon Mektron, Ltd.
G02B6/42G02B6/10G02B6/4245G02B6/43G02B6/424G02B6/4214Y10T29/49133
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Quick Facts
Patent No.
US 9,235,011
App. No.
13/566,145
Granted
Jan 12, 2016
Kind
B2
Abstract

A light emitting device and a light receiving device are in a bare chip form and are a light emitting device of surface emitting type and a light receiving device of surface receiving type having an electrode on an opposite surface of a light emitting portion and a light receiving portion respectively, the light emitting device, the light receiving device, and an optical waveguide are mounted on one surface of a flexible printed wiring board body, the light emitting portion of the light emitting device, an optical waveguide core, and the light receiving portion of the light receiving device are arranged substantially coaxially, and the light emitting device and the light receiving device are mounted in such a way that a light emitting/receiving direction is substantially 90° with respect to an orthogonal direction of a surface of the flexible printed wiring board body.

Claims (16)

1. An optical and electrical mixed flexible printed wiring board, comprising:

a flexible printed wiring board body having at least one layer of a conductive layer and a flexible insulating layer and an optical waveguide bonded to the flexible printed wiring board body via an adhesive,

wherein

the optical waveguide includes at least one flexible optical waveguide core having at least two optical input/output portions and a flexible optical waveguide cladding at least in contact with the optical waveguide core,

a light emitting device and a light receiving device are mounted on the flexible printed wiring board body and light from a light emitting portion of the light emitting device is transmitted to a light receiving portion through the optical waveguide,

the light emitting device and the light receiving device are in a bare chip form and are a light emitting device of surface emitting type and a light receiving device of surface receiving type having an electrode on an opposite surface of the light emitting portion and the light receiving portion respectively, and

the light emitting device, the light receiving device, and the optical waveguide are mounted on one surface of the flexible printed wiring board body, the light emitting portion of the light emitting device, the optical waveguide core, and the light receiving portion of the light receiving device are arranged substantially coaxially, and the light emitting device and the light receiving device are mounted in such a way that a light emitting/receiving direction is substantially parallel to the surface of the flexible printed wiring board body.

2. The optical and electrical mixed flexible printed wiring board according to claim 1 , wherein

each electrode of the light emitting device and the light receiving device is arranged closer to a fixed surface side of the light emitting device and the light receiving device to be a bottom side when mounted on the flexible printed wiring board body.

3. The optical and electrical mixed flexible printed wiring board according to claim 1 , wherein

the light emitting portion of the light emitting device and a light input portion of the optical waveguide, and the light receiving portion of the light receiving device and a light output portion of the optical waveguide are each sealed by an integral sealing resin.

4. A method of mounting a light emitting device and a light receiving device on the optical and electrical mixed flexible printed wiring board according to claim 1 , comprising:

if the light emitting device and the light receiving device are denoted as a light emitting/receiving device and a light emitting portion and a light receiving portion of the light emitting device and the light receiving device are denoted as a light emitting/receiving portion of the light emitting/receiving device, recognizing the light emitting/receiving device to be picked up by a first camera from many light emitting/receiving devices placed with the light emitting/receiving portion being directed upward;

gripping two opposed end faces of four end faces at right angles to a light emitting/receiving surface on which the light emitting/receiving portion is provided of the recognized light emitting/receiving device to be picked up by a pickup tool and moving the light emitting/receiving device into a mounting apparatus;

rotating the pickup tool by 90°, sucking and holding a surface on an opposite side of the light emitting/receiving surface of the rotated light emitting/receiving device by a suction unit, directing a light emitting/receiving direction of the light emitting/receiving portion in a horizontal direction, and directing a bottom fixed surface of the four end faces of the light emitting/receiving device downward while the bottom fixed surface protruding from a suction holding portion of the suction unit; and

recognizing an outer shape of the light emitting/receiving device sucked and held by the suction unit by a second camera, moving the light emitting/receiving device to a mounting stage, and mounting the light emitting/receiving device by fixing a fixing surface to the flexible printed wiring board body in such a way that the light emitting/receiving direction is substantially parallel to the surface of the flexible printed wiring board body.

Assignments (2)
CHANGE OF NAME Recorded Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2012
From: TAKANO, SHOJI; MATSUDA, FUMIHIKO
To: NIPPON MEKTRON, LTD.
Reel/Frame 028718/0515 →
Priority Claims (1)
JP 2011-172163 · Aug 5, 2011 · national
Continuity (1)
Related Publication 20130032703A1 · Feb 7, 2013