IP Library Granted Patent US 9,655,239
Granted Patent B2
US 9,655,239 · App. 14/868,619 · Granted May 16, 2017

Flexible printed circuit board with component mounting section for mounting electronic component and flexible cable sections extending in different directions from the component mounting section

Inventor: Fumihiko Matsuda (Ryugasaki, JP)
Assignee: NIPPON MEKTRON, LTD.
H05K1/11H05K1/028H05K1/0346H05K1/142H05K3/0097H05K3/36H05K3/361H05K1/118H05K2201/052
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Quick Facts
Patent No.
US 9,655,239
App. No.
14/868,619
Granted
May 16, 2017
Kind
B2
Abstract

A method of manufacturing a flexible printed circuit board that includes a component mounting section having lands, a plurality of flexible cable sections having wirings and extending in different directions from the component mounting section, and a connection section having terminals connected with the land through the wiring, the method including manufacturing partial FPCs in a sheet in a unit of a partial FPC that includes a partial component mounting section that is a part of the component mounting section, a cable section extending from the partial component mounting section, and a connection section disposed in the cable section, cutting out the partial FPC from the sheet, performing an alignment using alignment targets of the partial FPC and a support plate so that the partial component mounting sections ( 1 A) of respective partial FPCs configure the component mounting section, and fixing the partial FPCs onto the support plate.

Claims (2)

1. A flexible printed circuit board, comprising: a support plate; two first partial flexible printed circuit boards, each of which includes a first partial component mounting section having a first land formed on a surface thereof and a first interlayer conduction path electrically connected with the first land, and a flexible cable section extending from the first partial component mounting section; two second partial flexible printed circuit boards, each of which includes a second partial component mounting section having a second land formed on a surface thereof and a second interlayer conduction path electrically connected with the second land, and a flexible cable section extending from the second partial component mounting section; wherein a lower component mounting section, which is configured such that the two of the first partial component mounting sections are arranged on a first plane, being fixed onto the support plate; an upper component mounting section, which is configured such that the two of the second partial component mounting sections are arranged on a second plane, being stacked on the lower component mounting section through an anisotropic conductive layer having a conductive particle; and the first land being electrically connected with the second land positioned directly thereon through the conductive particle and the second interlayer conduction path.

2. The flexible printed circuit board according to claim 1 , wherein a plurality of the first interlayer conduction paths is provided with the first partial component mounting section, a plurality of the second interlayer conduction paths is provided with the second partial component mounting section, a wiring for electrically connecting the first interlayer conduction path with a terminal of a connection section disposed at a leading end of the flexible cable section extending from the first partial component mounting section is disposed between the neighboring first interlayer conduction paths, and a wiring for electrically connecting the second interlayer conduction path with a terminal of a connection section disposed at a leading end of the flexible cable section extending from the second partial component mounting section is disposed between the neighboring second interlayer conduction paths.

Assignments (2)
CHANGE OF NAME Recorded Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2015
From: MATSUDA, FUMIHIKO
To: NIPPON MEKTRON, LTD.
Reel/Frame 037256/0807 →
Priority Claims (1)
JP 2010-167411 · Jul 26, 2010 · national
Continuity (2)
Division 13138752
Related Publication 20160044784A1 · Feb 11, 2016