IP Library Assignment 029041/0277
Patent Assignment
Reel/Frame 029041/0277

Merger

Recorded: 2012-09-28 Pages: 8
Assignor
Assignee
ADL ENGINEERING INC.
5F, NO.65, GUANGFU N. RD., ZHONGXING VIL., HUKOU TOWNSHIP,, HSINCHU COUNTY, 303, TAIWAN
Covered Property (1)
Chip Packaging Structure
Patent: 8,304,923 →
Application: 11/692,933 →
Publication: US 2008/0237834
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 14, 2007
From: HU, DYI-CHUNG; HU, YU-SHAN; LIN, CHIH-WEI
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 019160/0285 →
Merger Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →