IP Library Assignment 029047/0530
Patent Assignment
Reel/Frame 029047/0530

Assignment of Assignor's Interest

Recorded: 2012-09-28 Pages: 3
Assignors
RAGHUNATHAN, VINODHKUMAR
Executed: 2012-09-26
ANDIDEH, EBRAHIM
Executed: 2012-09-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Methods of Providing Dielectric to Conductor Adhesion in Package Structures
Patent: 9,136,221 →
Application: 13/630,500 →
Publication: US 2014/0091469
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →