Patent Assignment
Reel/Frame 029059/0391
Assignment of Assignor's Interest
Recorded: 2012-09-25
Pages: 5
Assignors
PARK, JIN-WOO
Executed: 2012-09-07
SONG, HOGEON
Executed: 2012-09-07
LEE, SEOKHYUN
Executed: 2012-09-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Fan-Out Wafer Level Packages and Packages Formed by the Methods