Patent Assignment
Reel/Frame 029064/0613
Assignment of Assignor's Interest
Recorded: 2012-10-02
Pages: 2
Assignors
CHEN, CHIH-HUA
Executed: 2012-09-18
CHEN, CHEN-SHIEN
Executed: 2012-09-18
HSIAO, CHING-WEN
Executed: 2012-09-18
TSENG, MING HUNG
Executed: 2012-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Apparatus and Method for a Component Package