Patent Assignment
Reel/Frame 029084/0387
Assignment of Assignor's Interest
Recorded: 2012-10-05
Pages: 2
Assignors
CHIANG, TSUNG-HSIEN
Executed: 2012-09-24
TSENG, MING HUNG
Executed: 2012-09-24
CHEN, CHEN-SHIEN
Executed: 2012-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Thermally Enhanced Package-on-Package (PoP)