IP Library Assignment 029111/0236
Patent Assignment
Reel/Frame 029111/0236

Assignment of Assignor's Interest

Recorded: 2012-10-11 Pages: 6
Assignors
XIONG, HUIJUN
Executed: 2012-10-10
MAGNI, PIERANGELO
Executed: 2012-10-11
Assignees
STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
12 GAO KE ROAD, BAOLONG INDUSTRIAL PARK, LONGGANG DISTRICT, SHENZHEN, 518116, CHINA
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI 2, AGRATE BRIANZA, 20041, ITALY
Covered Property (1)
Lead Frame Having Increased Stability Due to Reinforced Die Pads and Packaging Method Using Such Lead Frame
Patent: 8,736,038 →
Application: 13/615,185 →
Publication: US 2013/0075885
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2015
From: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
To: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
Reel/Frame 034744/0460 →