IP Library › Assignment 034744/0460
Patent Assignment
Reel/Frame 034744/0460

Assignment of Assignor's Interest

Recorded: 2015-01-19 Pages: 5
Assignor
Assignee
STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
4F&B501-B503 & 6F & B701-B702, BLOCK B, TCL R&D TOWER, NO. 6, SOUTHERN NO. 1 ROAD, SOUTH DISTRICT, HI-TECH INDUSTRIAL PARK, NANSHAN, SHENZHEN, 518057, CHINA
Covered Properties (6)
Lead Frame Having Increased Stability Due to Reinforced Die Pads and Packaging Method Using Such Lead Frame
Patent: 8,736,038 →
Application: 13/615,185 →
Publication: US 2013/0075885
Imaging Device with Adhesive Filling Openings and Related Methods
Patent: 9,083,872 →
Application: 14/032,607 →
Publication: US 2014/0092297
Image Sensor Device with Aligned Ir Filter and Dielectric Layer and Related Methods
Patent: 9,419,047 →
Application: 14/135,743 →
Publication: US 2014/0184809
Proximity Detector Device with Interconnect Layers and Related Methods
Patent: 9,768,341 →
Application: 14/259,344 →
Publication: US 2014/0319548
Image Detector with Lens Assembly and Related Methods
Patent: 9,313,386 →
Application: 14/336,060 →
Publication: US 2015/0029384
Leadless Surface Mount Assembly Package and Method of Manufacturing the Same
Patent: 9,177,939 →
Application: 14/553,799 →
Publication: US 2015/0145110
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 11, 2012
From: XIONG, HUIJUN; MAGNI, PIERANGELO
To: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.; STMICROELECTRONICS S.R.L.
Reel/Frame 029111/0236 →
Assignment of Assignor's Interest Sep 23, 2013
From: LUAN, JING-EN
To: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
Reel/Frame 031260/0499 →
Assignment of Assignor's Interest Mar 25, 2014
From: LUAN, JING-EN
To: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
Reel/Frame 032519/0041 →
Assignment of Assignor's Interest Apr 24, 2014
From: LUAN, JING-EN
To: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
Reel/Frame 032746/0997 →
Assignment of Assignor's Interest Jul 23, 2014
From: LUAN, JING-EN
To: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
Reel/Frame 033372/0158 →
Assignment of Assignor's Interest Dec 4, 2014
From: LUAN, JING-EN
To: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
Reel/Frame 034381/0591 →
Assignment of Assignor's Interest Jun 28, 2022
From: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060340/0834 →
Assignment of Assignor's Interest Dec 15, 2022
From: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 062101/0042 →