Patent Assignment
Reel/Frame 034381/0591
Assignment of Assignor's Interest
Recorded: 2014-12-04
Pages: 3
Assignor
LUAN, JING-EN
Executed: 2014-01-22
Assignee
STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
12 GAO KE ROAD, BAOLONG INDUSTRIAL PARK, LONGGANG DISTRICT, GUANGDONG PROVINCE, SHENZHEN, 518116, CHINA
Covered Property
(1)
Leadless Surface Mount Assembly Package and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 19, 2015
From: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
To: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
Reel/Frame 034744/0460 →
Assignment of Assignor's Interest
Dec 15, 2022
From: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 062101/0042 →