Leadless surface mount assembly package and method of manufacturing the same

1. A leadless surface mount assembly package, comprising:

a first lead;

a second lead;

a third lead;

a chip fixed on an upper surface of the first lead and electrically coupled to the third lead;

a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip; and

a molding compound for molding the first lead, the second lead, the chip, and the clip, the side wall ends of the first lead and the second lead being substantially flush with the side wall surfaces of the package, an end of the third lead is only exposed from the molding compound without outward extending from the molding compound and a side of the molding compound from which the third lead is exposed is different from a side of the molding compound from which the first lead and the second lead are exposed.

2. The package according to claim 1 , wherein lower surfaces of the first lead and the second lead are exposed from the package.

3. The package according to claim 1 , wherein the clip is of a bent shape, with one end of the clip being inserted into the second lead and connected to an interior region of the second lead to realize the coupling, and a lower surface of the other end of the clip is fixed on an upper surface of the chip.

4. The package according to claim 1 , wherein the clip is of a cap shape, the cap shape being flat at two ends and projecting outward in the middle, wherein a lower surface of one end of the clip is fixed on an upper surface of the second lead, and a lower surface of the other end of the clip is fixed on an upper surface of the chip.

5. The package according to claim 1 , wherein side wall ends of the first lead and the second lead exposed from the molding compound are located on opposite sides of the package.

6. The package according to claim 1 , wherein a lower surface of the third lead is exposed from the package.

7. A method for forming a surface mount assembly package, comprising:

providing an array of a plurality of first leads, a plurality of second leads, and a plurality of third leads;

fixing a plurality of chips to corresponding first leads, respectively;

coupling a plurality of clips to corresponding second leads, respectively;

coupling the plurality of chips to corresponding third leads, respectively;

fixing lower surfaces of the clips on upper surfaces of corresponding chips that are fixed to the first leads;

molding the plurality of first leads, the plurality of second leads, the plurality of third leads, the chip, and the clip using a molding compound to form a package array; and

cutting the package array to form a plurality of individual packages, in which ends of first leads, second leads, and third leads on the side walls of each formed package are only exposed from the molding compound without outward extending from the molding compound, the ends of the third leads being exposed from a side of the molding compound different from which the first lead and the second lead are exposed.

8. The method according to claim 7 , wherein forming a package array using a molding compound further comprises:

exposing lower surfaces of the first lead and the second lead from the package.

9. The method according to claim 7 , wherein the clips are of a bend shape, and

coupling the clips to corresponding second leads, respectively, comprises:

inserting one ends of the clips into the second leads and clipping the one ends of the clips to the second leads to realize the coupling, and fixing lower surfaces of the other ends of the clips on upper surfaces of the chips.

10. The method according to claim 7 , wherein the clips are of a cap shape that is flat in two ends and is projecting outward in the middle, and

coupling the clips to the corresponding second pins, respectively, comprising:

fixing lower surfaces of one ends of the clips on upper surfaces of the second leads, and fixing lower surfaces of the other ends of the clips on upper surfaces of the chips.

11. A method for forming a surface mount assembly package, the method comprising:

providing a first lead, a second lead, and a third lead;

providing a chip;

fixing the chip on the first lead;

electrically coupling the chip to the third lead;

providing a clip;

coupling the clip and the second lead, and fixing a lower surface of the clip on an upper surface of the chip;

molding the first lead, the second lead, the third lead, the chip and the clip using a molding compound, thereby forming the package, wherein end walls of the first lead, the second lead, and the third lead are only exposed from the molding compound without outward extending from a sidewall of the molding compound.

12. The method according to claim 11 , wherein forming a package using a molding compound further comprises:

exposing lower surfaces of the first lead and the second lead from the package.

13. The method according to claim 11 , wherein, the clip is of a cap shape flat at two ends and projecting outward in the middle, and

coupling the clip to the second lead comprises:

fixing a lower surface of one end of the clip on an upper surface of the second lead, and fixing a lower surface of the other end of the clip on an upper surface of the chip.

14. The method according to claim 11 , wherein ends of the first lead and the second lead exposed from the molding compound are located at opposite sides of the package.