Patent Assignment
Reel/Frame 031260/0499
Assignment of Assignor's Interest
Recorded: 2013-09-23
Pages: 3
Assignor
LUAN, JING-EN
Executed: 2013-07-20
Assignee
STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
12 GAO KE ROAD, BAOLONG INDUSTRIAL PARK,, LONGGANG DISTRICT,, SHENZHEN, 518116, CHINA
Covered Property
(1)
Imaging Device with Adhesive Filling Openings and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 19, 2015
From: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO., LTD.
To: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
Reel/Frame 034744/0460 →
Assignment of Assignor's Interest
Jun 28, 2022
From: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060340/0834 →