Imaging device with adhesive filling openings and related methods
View Patent ↗An imaging device may include a housing, an image sensor IC in the housing, a lens adjacent the image sensor IC, and a cap over the lens and having an adhesive filling opening therein. The cap, the housing, and the lens may define an adhesive receiving cavity therein and in communication with the adhesive filling opening. The imaging device may also include adhesive material within the adhesive receiving cavity touching the cap, the housing, and the lens.
1. An imaging device comprising:
a housing;
an image sensor integrated circuit (IC) in said housing;
at least one lens adjacent to said image sensor IC;
a cap separate from said housing and being over said at least one lens and having at least one adhesive filling opening therein;
said cap, said housing, and said at least one lens defining at least one adhesive receiving cavity therein and in communication with the at least one adhesive filling opening; and
adhesive material within the at least one adhesive receiving cavity and touching said cap, said housing, and said at least one lens.
2. The imaging device of claim 1 wherein said cap has a rectangular shape defining four corners; wherein the at least one adhesive filling opening comprises a respective adhesive filling opening at each corner of said cap; and wherein the at least one adhesive receiving cavity comprises a respective adhesive receiving cavity adjacent each corner of said cap.
3. The imaging device of claim 1 wherein said cap has an asymmetrical shape.
4. The imaging device of claim 1 wherein said cap has a symmetrical shape.
5. The imaging device of claim 1 further comprising a spacer between said image sensor IC and said at least one lens.
6. The imaging device of claim 5 further comprising at least one adhesive joint between said image sensor IC and said spacer.
7. The imaging device of claim 1 wherein said at least one lens comprises a plurality thereof; and further comprising a spacer between adjacent lenses.
8. The imaging device of claim 1 further comprising an interconnect glass substrate over said image sensor IC and adjacent portions of said housing.
9. The imaging device of claim 8 further comprising at least one adhesive joint between said interconnect glass substrate and the adjacent portions of said housing.
10. The imaging device of claim 1 wherein said cap has an aperture therein aligned with said at least one lens.
11. An imaging device comprising:
a housing;
an image sensor integrated circuit (IC) in said housing;
at least one lens adjacent said image sensor IC;
a spacer between said image sensor IC and said at least one lens;
a rectangular shaped cap being separate from said housing, defining four corners, being over said at least one lens, and having a plurality of adhesive filling openings respectively at each corner thereof;
said rectangular shaped cap, said housing, and said at least one lens defining a plurality of adhesive receiving cavities therein and in communication respectively with said plurality of adhesive filling openings and also being adjacent each corner of said rectangular shaped cap; and
adhesive material within said plurality of adhesive receiving cavities and touching said rectangular shaped cap, said housing, and said at least one lens.
12. The imaging device of claim 11 wherein said rectangular shaped cap has an asymmetrical shape.
13. The imaging device of claim 11 wherein said rectangular shaped cap has a symmetrical shape.
14. The imaging device of claim 11 further comprising at least one adhesive joint between said image sensor IC and said spacer.
15. The imaging device of claim 11 wherein said at least one lens comprises a plurality thereof; and further comprising an other spacer between adjacent lenses.
16. The imaging device of claim 11 further comprising an interconnect glass substrate over said image sensor IC and adjacent portions of said housing.
17. A method of making an imaging device comprising:
positioning an image sensor integrated circuit (IC) in a housing;
positioning at least one lens adjacent the image sensor IC;
positioning a cap separate from the housing to be over the at least one lens, the cap having at least one adhesive filling opening therein;
the cap, the housing, and the at least one lens defining at least one adhesive receiving cavity therein and in communication with the at least one adhesive filling opening; and
positioning adhesive material within the at least one adhesive receiving cavity and touching the cap, the housing, and the at least one lens.
18. The method of claim 17 wherein the cap has a rectangular shape defining four corners; wherein the at least one adhesive filling opening comprises a respective adhesive filling opening at each corner of the cap; and wherein the at least one adhesive receiving cavity comprises a respective adhesive receiving cavity adjacent each corner of the cap.
19. The method of claim 17 wherein the cap has an asymmetrical shape.
20. The method of claim 17 wherein the cap has a symmetrical shape.
21. The method of claim 17 further comprising positioning a spacer between the image sensor IC and the at least one lens.
22. The method of claim 21 further comprising forming at least one adhesive joint between the image sensor IC and the spacer.
23. The method of claim 17 wherein the at least one lens comprises a plurality thereof; and further comprising positioning a spacer between adjacent lenses.
24. The method of claim 17 further comprising positioning an interconnect glass substrate over the image sensor IC and adjacent portions of the housing.
25. The method of claim 24 further comprising forming at least one adhesive joint between the interconnect glass substrate and the adjacent portions of the housing.
26. The method of claim 17 wherein the cap has an aperture therein aligned with the at least one lens.