Patent Assignment
Reel/Frame 029123/0234
Assignment of Assignor's Interest
Recorded: 2012-10-12
Pages: 6
Assignors
LIU, PING-YIN
Executed: 2012-09-24
CHENG, KAI-WEN
Executed: 2012-09-24
HUANG, XIN-HUA
Executed: 2012-09-24
CHAO, LAN-LIN
Executed: 2012-09-24
TSAI, CHIA-SHIUNG
Executed: 2012-09-24
CHEN, XIAOMENG
Executed: 2012-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multiple Metal Layer Semiconductor Device and Low Temperature Stacking Method of Fabricating the Same