IP Library › Assignment 029137/0153
Patent Assignment
Reel/Frame 029137/0153

Assignment of Assignor's Interest

Recorded: 2012-10-16 Pages: 3
Assignors
LIU, JIQUAN
Executed: 2012-10-11
XIAO, SHENGAN
Executed: 2012-10-11
JI, WEI
Executed: 2012-10-11
Assignee
SHANGHAI HUA HONG NEC ELECTRONICS COMPANY, LIMITED
NO. 1188 CHUAN QIAO RD., PU DONG, SHANGHAI, 201206, CHINA
Covered Property (1)
Semiconductor Structures and Fabrication Methods Including Trench Filling
Patent: 8,779,423 →
Application: 13/652,812 →
Publication: US 2013/0105796
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jan 26, 2022
From: SHANGHAI HUA HONG NEC ELECTRONICS COMPANY, LIMITED; SHANGHAI GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
To: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 059288/0465 →