Patent Assignment
Reel/Frame 029159/0405
Assignment of Assignor's Interest
Recorded: 2012-10-19
Pages: 5
Assignee
PRECITEC OPTRONIK GMBH
SCHLEUSSNERSTRASSE 54, NEU-ISENBURG, 63263, GERMANY
Covered Property
(1)
Test Device for Testing a Bonding Layer Between Wafer-Shaped Samples and Test Process for Testing the Bonding Layer