Patent Assignment
Reel/Frame 029160/0853
Assignment of Assignor's Interest
Recorded: 2012-10-19
Pages: 9
Assignors
CHEN, HAIGUANG
Executed: 2012-09-10
SINHA, JAYDEEP
Executed: 2012-09-10
KAMENSKY, SERGEY
Executed: 2012-09-10
VEERARAGHAVAN, SATHISH
Executed: 2012-09-10
VUKKADALA, PRADEEP
Executed: 2012-09-10
Assignee
KLA-TENCOR CORPORATION
ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Systems, Methods and Metrics for Wafer High Order Shape Characterization and Wafer Classification Using Wafer Dimensional Geometry Tool