Patent Assignment
Reel/Frame 029161/0970
Assignment of Assignor's Interest
Recorded: 2012-10-19
Pages: 5
Assignors
KIM, JI-HYUNG
Executed: 2012-10-04
PARK, SANG-WOOK
Executed: 2012-10-04
LEE, CHONG-KUN
Executed: 2012-10-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Temperature Management Circuit, System on Chip Including the Same and Method of Managing Temperature