Patent Assignment
Reel/Frame 029168/0817
Assignment of Assignor's Interest
Recorded: 2012-10-22
Pages: 3
Assignee
SKLINK CO., LTD.
NKF BLDG. 4TH FLOOR, 1-2 HIGASIDA-CHO, KAWASAKIKU, KANAGAWA, KAWASAKI-SHI, 2100005, JAPAN
Covered Property
(1)
Wafer Level Package Structure and Method for Manufacturing the Same
Application:
13/418,134 →
Publication:
US 2013/0034934
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.