Patent Assignment
Reel/Frame 029522/0886
Assignment of Assignor's Interest
Recorded: 2012-12-21
Pages: 2
Assignor
SKLINK CO., LTD.
Executed: 2012-12-04
Assignee
DISCO CORPORATION
13-11 OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 1438580, JAPAN
Covered Properties
(2)
Circuit Substrate and Method of Manufacturing Same
Wafer Level Package Structure and Method for Manufacturing the Same
Application:
13/418,134 →
Publication:
US 2013/0034934
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.