Patent Assignment
Reel/Frame 029178/0862
Assignment of Assignor's Interest
Recorded: 2012-10-24
Pages: 2
Assignor
LIN, JING-CHENG
Executed: 2012-10-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Fan-Out Wafer Level Package Structure