Patent Assignment
Reel/Frame 029180/0606
Assignment of Assignor's Interest
Recorded: 2012-10-24
Pages: 4
Assignors
CHENG, MING-DA
Executed: 2012-07-23
LIN, HSIU-JEN
Executed: 2012-07-23
CHEN, CHENG-TING
Executed: 2012-07-23
CHEN, WEI-YU
Executed: 2012-07-23
LEE, CHIEN-WEI
Executed: 2012-07-23
LIU, CHUNG-SHI
Executed: 2012-07-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Warpage Control in the Packaging of Integrated Circuits