Patent Assignment
Reel/Frame 029210/0208
Assignment of Assignor's Interest
Recorded: 2012-10-30
Pages: 2
Assignors
WANG, TSUNG-DING
Executed: 2012-08-24
CHENG, JUNG WEI
Executed: 2012-08-24
LEE, BO-I
Executed: 2012-08-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Having a Recess Filled with a Molding Compound