Patent Assignment
Reel/Frame 029210/0737
Assignment of Assignor's Interest
Recorded: 2012-10-30
Pages: 3
Assignors
HO, YUEH-SE
Executed: 2012-10-29
XUE, YAN XUN
Executed: 2012-10-29
YILMAZ, HAMZA
Executed: 2012-10-29
LU, JUN
Executed: 2012-10-29
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Stacked Dual-Chip Packaging Structure and Preparation Method Thereof