Patent Assignment
Reel/Frame 029212/0727
Assignment of Assignor's Interest
Recorded: 2012-10-30
Pages: 2
Assignors
KUO, CHUN-TING
Executed: 2012-06-22
CHEN, KEI-WEI
Executed: 2012-06-22
WANG, YING-LANG
Executed: 2012-06-22
WEI, KUO-HSIU
Executed: 2012-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods for Minimizing Edge Peeling in the Manufacturing of BSI Chips