Patent Assignment
Reel/Frame 029218/0340
Assignment of Assignor's Interest
Recorded: 2012-10-31
Pages: 4
Assignors
LIU, PING-YIN
Executed: 2012-10-22
CHEN, SZU-YING
Executed: 2012-10-22
WANG, CHEN-JONG
Executed: 2012-10-22
HUANG, CHIH-HUI
Executed: 2012-10-22
HUANG, XIN-XUA
Executed: 2012-10-22
CHAO, LAN-LIN
Executed: 2012-10-22
TU, YEUR-LUEN
Executed: 2012-10-22
TSAI, CHIA-SHIUNG
Executed: 2012-10-22
CHEN, XIAOMENG
Executed: 2012-10-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Hybrid Bonding Mechanisms for Semiconductor Wafers