Patent Assignment
Reel/Frame 029232/0631
Assignment of Assignor's Interest
Recorded: 2012-11-02
Pages: 2
Assignors
HASHIMOTO, KATSUMI
Executed: 2012-10-10
NAKANISHI, MANABU
Executed: 2012-10-10
MATSUSHITA, TAKASHI
Executed: 2012-10-10
Assignee
SOKUDO CO., LTD.
TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI, KAMIGYO-KU, KYOTO-SHI, KYOTO 602-8585, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method for Performing Heat Treatment on Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.