Patent Assignment
Reel/Frame 029235/0926
Assignment of Assignor's Interest
Recorded: 2012-11-02
Pages: 3
Assignor
TERAOKA, YOSHITOMO
Executed: 2012-11-01
Assignee
HAKKO CORPORATION
4-5, SHIOKUSA 2-CHOME, NANIWA-KU, OSAKA CITY, OSAKA, 556-0024, JAPAN
Covered Property
(1)
Solder Handling Assembly