IP Library › Assignment 029243/0069
Patent Assignment
Reel/Frame 029243/0069

Assignment of Assignor's Interest

Recorded: 2012-11-05 Pages: 3
Assignors
QIAN, YIN
Executed: 2012-10-25
TAI, HSIN-CHIH
Executed: 2012-10-25
DAI, TIEJUN
Executed: 2012-10-25
MAO, DULI
Executed: 2012-10-25
YANG, CUNYU
Executed: 2012-10-25
RHODES, HOWARD E.
Executed: 2012-10-29
Assignee
OMNIVISION TECHNOLOGIES, INC.
4275 BURTON DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Die Seal Ring for Integrated Circuit System with Stacked Device Wafers
Patent: 9,142,581 →
Application: 13/669,107 →
Publication: US 2014/0124889