Assignment of Assignor's Interest

Recorded: 2012-11-06 Pages: 3

Assignors

CLARK, DAVID

Executed: 2012-10-16

TESSIER, THEODORE G.

Executed: 2012-10-01

Assignee

FLIPCHIP INTERNATIONAL, LLC

3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034

Covered Property (1)

Wafer Level Applied Thermal Heat Sink

Patent: 8,686,556 →

Application: 13/644,579 →

Publication: US 2013/0087904