Patent Assignment
Reel/Frame 029255/0268
Assignment of Assignor's Interest
Recorded: 2012-11-07
Pages: 3
Assignors
SIDHU, RAJEN S.
Executed: 2012-11-06
HU, WEI
Executed: 2012-11-06
DEPPISCH, CARL L.
Executed: 2012-11-06
DUDEK, MARTHA A.
Executed: 2012-11-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Solder Techniques and Configurations for Integrated Circuit Package Assembly