Patent Assignment
Reel/Frame 029258/0978
Assignment of Assignor's Interest
Recorded: 2012-11-07
Pages: 2
Assignor
WU, JIUN YI
Executed: 2012-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Contoured Package-on-Package Joint