Patent Assignment
Reel/Frame 029273/0938
Assignment of Assignor's Interest
Recorded: 2012-11-09
Pages: 3
Assignors
YEE, ABRAHAM F.
Executed: 2012-11-08
CHIPALKATTI, JAYPRAKASH
Executed: 2012-11-08
KALCHURI, SHANTANU
Executed: 2012-11-08
Assignee
NVIDIA CORPORATION
2701 SAN TOMAS EXPRESSWAY, SANTA CLARA, CALIFORNIA, 95050
Covered Property
(1)
Thermal Performance of Logic Chip in a Package-on-Package Structure