Patent Assignment
Reel/Frame 029304/0189
Assignment of Assignor's Interest
Recorded: 2012-11-15
Pages: 4
Assignors
NAMIKI, HIDETSUGU
Executed: 2012-09-11
ISHIGAMI, AKIRA
Executed: 2012-09-11
UMAKOSHI, HIDEAKI
Executed: 2012-09-22
KANISAWA, SHIYUKI
Executed: 2012-09-14
Assignee
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
GATE CITY OSAKI, EAST TOWER 8F., 1-11-2, OSAKI, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property
(1)
Curable Resin Composition, Adhesive Epoxy Resin Paste, Die-Bonding Agent, Non-Conductive Paste, Adhesive Epoxy Resin Film, Non-Conductive Epoxy Resin Film, Anisotropic Conductive Paste, and Anisotropic Conductive Film
Application:
13/640,540 →
Publication:
US 2013/0056686
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.