CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM
To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan δ in a viscoelastic spectrum and a value of the tan δ at −40° C. thereof is 0.1 or more.
1 . A curable resin composition comprising:
an epoxy resin and an epoxy resin-use curing agent,
wherein a difference between a maximum value of tan δ in a viscoelastic spectrum of the curable resin composition and a value of the tan δ at −40° C. thereof is 0.1 or more.
2 . The curable resin composition according to claim 1 , wherein the maximum value of tan δ is included in a range from −40° C. or more to 100° C. or less.
3 . The curable resin composition according to claim 1 , wherein the difference between the maximum value of tan δ and a value of the tan δ at −40° C. is in a range of 0.1 or more to 0.5 or less.
4 . The curable resin composition according to claim 1 , further comprising:
4.5 wt % or more of an acid anhydride having a ring structure of 6 or more ring members.
5 . The curable resin composition according to claim 1 4 , further comprising:
4.5 wt % or more of a glutaric anhydride.
6 . The curable resin composition according to claim 1 , further comprising:
5 to 50 wt % of a high molecular weight component having at least a molecular weight of 5000 or more.
7 . The curable resin composition according to claim 6 , wherein the high molecular weight component has a Tg of 50° C. or less.
8 . The curable resin composition according to claim 6 , wherein the high molecular weight component has a reactive functional group.
9 . An adhesive epoxy resin paste comprising: the curable resin composition according to claim 1 .
10 . A die bonding agent comprising: the adhesive resin paste according to claim 9 .
11 . A non-conductive paste comprising: the adhesive resin paste according to claim 9 .
12 . An adhesive epoxy resin film comprising:
the curable resin composition according to claim 1 ,
wherein the curable resin composition is molded into a film state.
13 . A non-conductive epoxy resin film comprising:
the adhesive epoxy resin film according to claim 12 .
14 . An anisotropic conductive paste comprising:
the adhesive epoxy resin paste according to claim 9 that contains conductive particles.
15 . An anisotropic conductive film comprising:
the adhesive epoxy resin film according to claim 12 that contains conductive particles.