Patent Assignment
Reel/Frame 029306/0394
Assignment of Assignor's Interest
Recorded: 2012-11-15
Pages: 5
Assignors
KO, JI-HAN
Executed: 2012-10-04
LEE, WOO-DONG
Executed: 2012-10-04
PARK, TAE-SUNG
Executed: 2012-10-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Chip Support and Method of Fabricating the Same