Patent Assignment
Reel/Frame 029324/0043
Assignment of Assignor's Interest
Recorded: 2012-11-19
Pages: 3
Assignors
MIYAZAKI, MASASHI
Executed: 2012-10-31
SUGIYAMA, YUICHI
Executed: 2012-10-31
HAMADA, YOSHIKI
Executed: 2012-10-31
HATA, YUTAKA
Executed: 2012-10-31
YOKOTA, HIDEKI
Executed: 2012-10-31
Assignee
TAIYO YUDEN CO., LTD.
16-20, UENO 6-CHOME, TAITO-KU, TOKYO, 110-0005, JAPAN
Covered Property
(1)
Electronic Component to Be Embedded in Substrate and Component-Embedded Substrate