IP Library › Assignment 029339/0422
Patent Assignment
Reel/Frame 029339/0422

Assignment of Assignor's Interest

Recorded: 2012-11-21 Pages: 10
Assignor
ELECTROGLAS, INC.
Executed: 2009-10-09
Assignee
SENECA MERGER SUB, INC.
7005 SOUTHFRONT ROAD, LIVERMORE, CALIFORNIA, 94085
Covered Property (1)
Thin Wafer Chuck
Patent: 8,336,188 →
Application: 12/175,359 →
Publication: US 2010/0013169
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 26, 2012
From: SENECA MERGER SUB, INC.
To: FORMFACTOR, INC.
Reel/Frame 029347/0346 →
Security Interest in United States Patents and Trademarks Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Release of Security Interest Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →