Patent Assignment
Reel/Frame 072853/0001
Release of Security Interest
Recorded: 2025-08-07
Pages: 64
Assignor
HSBC BANK USA, NATIONAL ASSOCIATION
Executed: 2025-08-06
Assignee
FORMFACTOR, INC.
7005 SOUTHFRONT ROAD, LIVERMORE, CALIFORNIA, 94551
Covered Properties
(677)
High Density Probe Card
Patent:
4,757,256 →
Application:
07/045,605 →
High Density Probe Card
Patent:
4,837,622 →
Application:
07/209,915 →
Non-Corrosive Compositions and Methods Useful for the Extraction of Nucleic Acids
Patent:
5,130,423 →
Application:
07/649,389 →
Peptide Linkers for Improved Oligonucleotide Delivery
Patent:
5,574,142 →
Application:
07/991,199 →
Method for Manufacturing Electrical Contacts, Using a Sacrificial Member
Patent:
5,476,211 →
Application:
08/152,812 →
Flexible Contact Structure with an Electrically Conductive Shell
Patent:
5,917,707 →
Application:
08/340,144 →
Method of Mounting Free-Standing Resilient Electrical Contact Structures to Electronic Components
Patent:
6,049,976 →
Application:
08/457,479 →
Sockets for Electronic Components and Method of Connecting to Electronics Components
Patent:
5,772,451 →
Application:
08/533,584 →
Probe Card Assembly
Patent:
5,974,662 →
Application:
08/554,902 →
Method of Mounting Resilient Contact Structures to Semiconductor Devices
Patent:
5,829,128 →
Application:
08/558,332 →
Method of Making Raised Contacts on Eletronic Components
Patent:
5,852,871 →
Application:
08/570,230 →
Method and Apparatus for Wirebonding, for Severing Bond Wires, and for Forming Balls on the Ends of Bond Wires
Patent:
5,601,740 →
Application:
08/573,945 →
Solder Preforms
Patent:
5,820,014 →
Application:
08/584,981 →
Modular Semiconductor Reliability Test System
Patent:
6,097,200 →
Application:
08/725,935 →
Semiconductor Devices with Integral Contact Structures
Patent:
6,242,803 →
Application:
08/735,810 →
Contact Structure Device for Interconnections, Interposer, Semiconductor Assembly and Package Using the Same and Method
Patent:
5,900,738 →
Application:
08/735,811 →
Interconnection Substrates with Resilient Contact Structures on Both Sides
Patent:
6,274,823 →
Application:
08/735,812 →
Method of Stacking Electronic Components
Patent:
5,926,951 →
Application:
08/735,813 →
Resilient Contact Structures, Electronic Interconnection Component, and Method of Mounting Reslitent Contact Structures to Electronic Components
Patent:
6,184,587 →
Application:
08/735,815 →
Probe for Semiconductor Devices
Patent:
7,084,656 →
Application:
08/735,816 →
Contact Structure Device for Interconnections, Interposer, Semiconductor Assembly and Package Using the Same and Method
Patent:
6,476,333 →
Application:
08/735,817 →
Wafer-Level Burn-in and Test
Patent:
6,064,213 →
Application:
08/784,862 →
Fabricating Interconnects and Tips Using Sacrificial Substrates
Patent:
5,994,152 →
Application:
08/788,740 →
Contact Carriers (Tiles) for Populating Larger Substrates with Spring Contacts
Patent:
5,806,181 →
Application:
08/789,147 →
Method for Shaping Spring Elements
Patent:
6,442,831 →
Application:
08/794,202 →
Method of Severing Bond Wires and Forming Balls at Their Ends
Patent:
5,773,780 →
Application:
08/797,023 →
Microelectric Contact Spring Structure, and Method of Making Same
Method of Making Contact Tip Structures
Patent:
5,864,946 →
Application:
08/839,758 →
Method of Testing Semiconductor Devices
Patent:
5,998,228 →
Application:
08/839,759 →
Mounting Spring Elements on Semiconductor Devices
Patent:
5,884,398 →
Application:
08/839,760 →
Method of Making Temporary Connections Between Electronic Components
Patent:
5,832,601 →
Application:
08/839,762 →
Method of Temporarily Then Permanently Connecting to a Semiconductor Device
Patent:
5,983,493 →
Application:
08/839,763 →
Wafer-Level Test and Burn-in, and Semiconductor Process
Patent:
6,032,356 →
Application:
08/839,771 →
Method of Burning-in Semiconductor Devices
Patent:
5,878,486 →
Application:
08/839,772 →
Method of Making Microelectronic Spring Contact Elements
Patent:
6,184,053 →
Application:
08/852,152 →
Method and Apparatus for Applying a Layer of Flowable Coating Material to a Surface of an Electronic Component
Patent:
5,912,046 →
Application:
08/854,203 →
Stacking Semiconductor Devices, Particularly Memory Chips
Patent:
5,998,864 →
Application:
08/863,511 →
Probe Station Having Inner and Outer Shielding
Patent:
6,002,263 →
Application:
08/870,335 →
Probe Station Having Environment Control Chamber with Orthogonally Flexible Lateral Wall Assembly
Patent:
5,963,027 →
Application:
08/870,397 →
Low-Current Pogo Probe Card
Patent:
6,034,533 →
Application:
08/871,609 →
Making Discrete Power Connections to a Space Transformer of a Probe Card Assembly
Patent:
6,050,829 →
Application:
08/920,255 →
Partially-Overcoated Elongate Contact Structures
Patent:
6,307,161 →
Application:
08/926,898 →
Electronic Component with Terminals and Spring Contact Elements Extending from Areas Which Are Remote from the Terminals
Patent:
6,043,563 →
Application:
08/955,001 →
Contact Carriers (Tiles) for Populating Larger Substrates with Spring Contacts
Patent:
6,741,085 →
Application:
08/994,799 →
Microelectronic Contact Structures, and Methods of Making Same
Patent:
6,520,778 →
Application:
09/023,859 →
Probe Card Assembly and Kit
Pc Board Having Clustered Blind Vias
Patent:
6,720,501 →
Application:
09/060,308 →
Method and Apparatus for Controlling Plating Over a Face of a Substrate
Patent:
6,090,261 →
Application:
09/083,206 →
Apparatus for Controlling Plating Over a Face of a Substrate
Patent:
6,042,712 →
Application:
09/083,328 →
A Method of Modifying the Thickness of a Plating on a Member by Creating a Temperature Gradient on the Member, Applications for Employing Such a Method, and Structures Resulting from Such a Method
Patent:
6,110,823 →
Application:
09/089,817 →
Chip-Scale Carrier for Semiconductor Devices Including Mounted Spring Contacts
Patent:
6,023,103 →
Application:
09/106,943 →
Interposer, Socket and Assembly for Socketing an Electronic Component and Method of Making and Using Same
Patent:
6,669,489 →
Application:
09/107,924 →
Sockets for "Springed" Semiconductor Devices
Patent:
6,033,935 →
Application:
09/108,163 →
Electrical Interconnect Assemblies and Methods
Interconnect Assemblies and Methods Including Ancillary Electronic Component Connected in Immediate Proximity of Semiconductor Device
Patent:
6,330,164 →
Application:
09/114,589 →
Membrane Probing System
Patent:
6,256,882 →
Application:
09/115,571 →
Composite Interconnection Elements for Microelectronic Components, Methods of Making Same
Patent:
6,029,344 →
Application:
09/132,843 →
Probe Card Assembly and Kit, and Methods of Using Same
Patent:
6,246,247 →
Application:
09/156,957 →
Contact Structures with Blades Having a Wiping Motion
Patent:
6,441,315 →
Application:
09/189,761 →
Large Contactor with Multiple, Aligned Contactor Units
Patent:
6,690,185 →
Application:
09/196,924 →
Probe Card for Probing Wafers with Raised Contact Elements
Patent:
6,483,328 →
Application:
09/204,740 →
Method of Making and Using Lithographic Contact Springs
Patent:
6,268,015 →
Application:
09/205,022 →
Lithographic Contact Elements
Patent:
6,255,126 →
Application:
09/205,023 →
Method of Making a Product with Improved Material Properties by Moderate Heat-Treatment of a Metal Incorporating a Dilute Additive
Patent:
6,150,186 →
Application:
09/217,589 →
Concurrent Design and Subsequent Partitioning of Product and Test Die
Patent:
6,429,029 →
Application:
09/224,166 →
Special Contact Points for Accessing Internal Circuitry of an Integrated Circuit
Patent:
6,456,099 →
Application:
09/224,169 →
Test Assembly Including a Test Die for Testing a Semiconductor Product Die
Patent:
6,551,844 →
Application:
09/224,673 →
An electronic assembly having at least two substrates with a plurality of elongate springable interconnection elements between the substrates
Patent:
6,215,670 →
Application:
09/245,779 →
Filter Structures for Integrated Circuit Interfaces
Patent:
6,208,225 →
Application:
09/258,184 →
Integrated Circuit Interconnect System
Patent:
6,448,865 →
Application:
09/258,185 →
High Bandwidth Passive Integrated Circuit Tester Probe Card Assembly
Patent:
6,218,910 →
Application:
09/258,186 →
Parallel Testing of Integrated Circuit Devices Using Cross-Dut and Within-Dut Comparisons
Patent:
6,480,978 →
Application:
09/260,459 →
Efficient Parallel Testing of Integrated Circuit Devices Using a Known Good Device to Generate Expected Responses
Patent:
6,452,411 →
Application:
09/260,460 →
Distributed Interface for Parallel Testing of Multiple Devices Using a Single Tester Channel
Patent:
6,499,121 →
Application:
09/260,463 →
Method and Apparatus for the Transport and Tracking of an Electronic Component
Patent:
6,644,982 →
Application:
09/260,466 →
Method for Processing an Integrated Circuit Including Placing Dice into a Carrier and Testing
Patent:
6,887,723 →
Application:
09/260,794 →
Method for Mounting an Electronic Component
Tip Structures.
Segmented Contactor
Patent:
7,215,131 →
Application:
09/327,116 →
Variable Width Resilient Conductive Contact Structures
Patent:
7,435,108 →
Application:
09/364,788 →
Electrical Contactor Especially Wafer Level Contactor Using Fluid Pressure
Patent:
6,468,098 →
Application:
09/376,759 →
Method and Apparatus for Burning-in Semiconductor Devices in Wafer Form
Patent:
6,655,023 →
Application:
09/468,620 →
Interconnect for Microelectronic Structures with Enhanced Spring Characteristics
Spring Interconnect Structures
Patent:
6,672,875 →
Application:
09/474,788 →
Methods for Making Spring Interconnect Structures
Patent:
6,491,968 →
Application:
09/474,789 →
Apparatus For Reducing Power Supply Noise In An Integrated Circuit
Patent:
6,339,338 →
Application:
09/484,600 →
Process of Mounting Spring Contacts to Semiconductor Devices
Patent:
6,168,974 →
Application:
09/499,963 →
Integrated Circuit Interconnect System Forming a Multi-Pole Filter
Patent:
6,459,343 →
Application:
09/510,657 →
Sockets for "springed" semiconductor devices
Patent:
6,232,149 →
Application:
09/519,279 →
Planarizer for a Semiconductor Contactor
Patent:
6,509,751 →
Application:
09/528,064 →
Electronic component with terminals and spring contct elements extwnding from areas which are remote from the terminals
Patent:
6,215,196 →
Application:
09/536,223 →
Lithographically Defined Microelectronic Contact Structures
Patent:
7,714,235 →
Application:
09/539,287 →
A Method for Conctructing a Membrane Probe Using a Depression
Patent:
6,578,264 →
Application:
09/546,927 →
Method of Fabricating Shaped Springs
Patent:
6,640,432 →
Application:
09/547,560 →
Shaped Spring
Patent:
7,458,816 →
Application:
09/547,561 →
System for Measuring Signal Path Resistance for an Integrated Circuit Tester Interconnect Structure
Patent:
6,677,744 →
Application:
09/548,886 →
Method for Testing Signal Paths Between an Integrated Circuit Wafer and a Wafer Tester
Patent:
6,476,630 →
Application:
09/568,460 →
Wafer-Level Burn-in and Test
Patent:
6,525,555 →
Application:
09/573,489 →
Method and Apparatus for Controlling Plating Over a Face of a Substrate
Patent:
6,685,817 →
Application:
09/591,107 →
Electrical Contact Structures Formed by Configuring a Flexible Wire to Have a Springable Shape and Overcoating the Wire with at Least One Layer of a Resilient Conductive Material, Methods of Mounting the Contact Structures to Electronic Components, and Applications
Patent:
6,727,579 →
Application:
09/592,487 →
System for Calibrating Timing of an Integrated Circuit Wafer Tester
Patent:
6,622,103 →
Application:
09/598,399 →
Method and Apparatus for Sub-Micron Imaging and Probing on Probe Station
Patent:
6,377,066 →
Application:
09/610,668 →
Closed-Grid Bus Architecture for Wafer Interconnect Structure
Patent:
6,603,323 →
Application:
09/613,531 →
Membrane Probing System
Microelectronic Spring Contact Elements
Patent:
6,727,580 →
Application:
09/694,205 →
Lithographic Type Microelectronic Spring Structures with Improved Contours
Patent:
7,189,077 →
Application:
09/710,539 →
Method of Designing, Fabricating, Testing and Interconnecting an Ic to External Circuit Nodes
Composite Microelectronic Spring Structure and Method for Making Same
Electrical Contact Structures Formed by Configuring a Flexible Wire to Have a Springable Shape and Overcoating the Wire with at Least One Layer of a Resilient Conductive Material, Methods of Mounting the Contact Structures to Electronic Components, and Applications
Resilient Contact Structures for Interconnecting Electronic Devices
Interconnect Assemblies and Methods
Special Contact Points for Accessing Internal Circuitry of an Integrated Circuit
Cross-Correlation Timing Calibration for Wafer-Level Ic Tester Interconnect Systems
Method of Making Microelectronic Contact Structures
Special Contact Points for Accessing Internal Circuitry of an Integrated Circuit
Method and Apparatus for Shaping Spring Elements
Method and Apparatus for Shaping Spring Elements
Special Contact Points for Accessing Internal Circuitry of an Integrated Circuit
Method for Mounting a Plurality of Spring Contact Elements
Special Contact Points for Accessing Internal Circuitry of an Integrated Circuit
High Frequency Printed Circuit Board Via
Lithographic Contact Elements
Method for Forming Microelectronic Spring Structures on a Substrate
Method of Making Lithographic Contact Springs
Forming Tool for Forming a Contoured Microelectronic Spring Mold
Integrated Circuit Tester with High Bandwidth Probe Assembly
Wafer Level Interposer
Membrane Probing System
Probe Holder for Low Current Measurements
Filter Structures for Integrated Circuit Interfaces
Sockets for " Springed " Semiconductor Devices
Patent:
6,534,856 →
Application:
09/819,143 →
Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via
Probe Card with Coplanar Daughter Card
Stacked Semiconductor Device Assembly with Microelectronic Spring Contacts
Microelectronic Spring with Additional Protruding Member
A Method of Making a Contact Structure with a Distinctly Formed Tip Structure
Method for Manufacturing Raised Electrical Contact Pattern of Controlled Geometry
Electromagnetically Coupled Interconnect System Architecture
Electronic Components with Plurality of Contoured Microelectronic Spring Contacts
Probe Station
High Density Planar Electrical Interface
Method of Manufacturing a Probe Card
Fiducial Alignment Marks on Microelectronic Spring Contacts
Process and Apparatus for Finding Pahts Through a Routing Space
Process and Apparatus for Adjusting Traces
Contact tip structure for microelectronic interconnection elements and method of making same
Application:
09/953,666 →
Publication:
US 2003/0199179
Method and System for Designing a Probe Card
Method of Assembling and Testing an Electronics Module
Multiple Die Interconnect System
Electronic Component Overlapping Dice of Unsingulated Semiconductor Wafer
Apparatuses and Methods for Cleaning Test Probes
Wafer Probe
Fan Out of Interconnect Elements Attached to Semiconductor Wafer
Method and System for Compensating for Thermally Induced Motion of Probe Cards
Apparatus for Reducing Power Supply Noise in an Integrated Circuit
Adjustable Delay Transmission Line
Patent:
6,816,031 →
Application:
10/006,178 →
Probe Card Assembly
Probe Card Covering System and Method
Electronic Package with Direct Cooling of Active Electronic Components
Probe Card Cooling Assembly with Direct Cooling of Active Electronic Components
Inductive Heating of Microelectronic Components
Microelectronic Spring Contact Repair
Method and System for Compensating Thermally Induced Motion of Probe Cards
A tested semiconductor device produced by adjusting a planar orientation of probe elements of a probe card
Application:
10/034,528 →
Publication:
US 2002/0053734
Probe Card Assembly and Kit, and Methods of Making Same
Semiconductor Fuse Covering
Patent:
6,479,308 →
Application:
10/034,608 →
Method and System for Detecting an Arc Condition
Resilient Contact Structures Formed and Then Attached to a Substrate
Apparatus for Reducing Power Supply Noise in an Integrated Circuit
Method of Manufacturing a Probe Card
Re-Assembly Process for Mems Structures
Integrated Circuit Interconnect System
Substrate-Holding Device for Testing Circuit Arrangements on Substrates
High Performance Probe System
Test Signal Distribution System for Ic Tester
Tester Channel to Multiple Ic Terminals
Method and System for Compensating Thermally Induced Motion of Probe Cards
Interconnection Element with Contact Blade
Test Method for Yielding a Known Good Die
Method and Device to Clean Probes
Compensation for Test Signal Degradation Due to Dut Fault
Probe Card Assembly for Contacting a Device with Raised Contact Elements
Method of Making Microelectronic Spring Contact Array
Microelectronic Contact Structures, and Methods of Making Same
Segmented Contactor
Predictive, Adaptive Power Supply for an Integrated Circuit Under Test
Efficient Parallel Testing of Semiconductor Devices Using a Known Good Device to Generate Expected Responses
Integrated Circuit Interconnect System
Method for Manufacturing a Multi-Layer Printed Circuit Board
Electrical Contractor, Especially Wafer Level Contactor, Using Fluid Pressure
Semiconductor Fuse Covering
Probe Station Having Multiple Enclosures
Probe Holder for Testing of a Test Device
Integrated Circuit Tester with High Bandwidth Probe Assembly
Distributed Interface for Parallel Testing of Multiple Devices Using a Single Tester Channel
Method for Manufacturing Raised Electrical Contact Pattern of Controlled Geometry
Sockets for "Springed" Semiconductor Devices
Using Electric Discharge Machining to Manufacture Probes
High Frequency Printed Circuit Board Via
Probe Station Thermal Chuck with Shielding for Capacitive Current
Method for Making a Socket to Perform Testing on Integrated Circuits and Socket Made
Test Assembly Including a Test Die for Testing a Semiconductor Product Die
Integrated Circuit Assembly
Guarded Tub Enclosure
Apparatus and Method for Limiting Over Travel in a Probe Card Assembly
Wafer-Level Burn-in and Test
Microelectronic Contact Structure
Composite Motion Probing
Method of Designing , Fabricating, Testing and Interconnecting an Ic to External Circuit Nodes
Closed-Grid Bus Architecture for Wafer Interconnect Structure
Layered Microelectronic Contact and Method for Fabricating Same
Helical Microelectronic Contact and Method for Fabricating Same
Method of Probing a Device Using Captured Image of Probe Structure in Which Probe Tips Comprise Alignment Features
Method for Constructing a Membrane Probe Using a Depression
High Performance Probe System
Rhodium Electroplated Structures and Methods of Making Same
Probe Card Assembly
Insulative Covering of Probe Tips
Method of Making an Electronics Module
Apparatus and Method for Electromechanical Testing and Validation of Probe Cards
Methods of Fabricating and Using Shaped Springs
Probe Station with Low Noise Characteristics
Patent:
6,847,219 →
Application:
10/666,219 →
Segmented Contactor
Probe Station with Low Inductance Path
Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
Sockets for "Springed" Semiconductor Device
Test Apparatus for Testing Substrates at Low Temperatures
Test Apparatus with Loading Device
Methods of Removably Mounting Electronic Components to a Circuit Board, and Sockets Formed by the Methods
Wireless Test System
Contact Carriers (Tiles) for Populating Larger Substrates with Spring Contacts
Microelectronic contact structures, and methods of making same
Application:
10/692,174 →
Publication:
US 2004/0072452
Isolation Buffers with Controlled Equal Time Delays
Process and Apparatus for Finding Paths Through a Routing Space
Membrane Probing Method Using Improved Contact
Interconnect for Microelectronic Structures with Enhanced Spring Characteristics
Methods for Making Plated Through Holes Usable as Interconnection Wire or Probe Attachments
Predictive, Adaptive Power Supply for an Integrated Circuit Under Test
Interconnect Assemblies and Methods
Socket for Mating with Electronic Component, Particularly Semiconductor Device with Spring Packaging, for Fixturing, Testing, Burning-in or Operating Such a Component
Integrated Circuit Tester with High Bandwidth Probe Assembly
Integrated Circuit Interconnect System
Spring Interconnect Structures
System for Measuring Signal Path Resistance for an Integrated Circuit Tester Interconnect Structure
Method for Testing Signal Paths Between an Integrated Circuit Wafer and a Wafer Tester
Probe Card Configuration for Low Mechanical Flexural Strength Electrical Routing Substrates
Membrane Probing System
Contactless Interfacing of Test Signals with a Device Under Test
A Method and Apparatus for Probing an Electronic Device in Which Movement of Probes and/or the Electronic Device Includes a Lateral Component
Probe Testing Structure
Automated System for Designing and Testing a Probe Card
Apparatus for Providing a High Frequency Loop Back with a Dc Path for a Parametric Test
Systems and Methods for Wireless Semiconductor Device Testing
Microelectronic Spring Contact Elements
Method of Manufacturing a Probe Card
Method and Apparatus for Calibrating Communications Channels
Intelligent Probe Card Architecture
Method to Build Robust Mechanical Structures on Substrate Surfaces
Closed-Grid Bus Architecture for Wafer Interconnect Structure
Tester Channel to Multiple Ic Terminals
Probe for Testing a Device Under Test
Freely Deflecting Knee Probe with Controlled Scrub Motion
Apparatuses and Methods for Planarizing a Semiconductor Contactor
Photoresist Formulation for High Aspect Ratio Plating
Mechanically Reconfigurable Vertical Tester Interface for Ic Probing
Method and Prober for Contacting a Contact Area with a Contact Tip
Double Acting Spring Probe
Cantilever Probe with Dual Plane Fixture and Probe Apparatus Therewith
Probe Card Assembly
Remote Test Facility with Wireless Interface to Local Test Facilities
Method and Apparatus for Verifying Planarity in a Probing System
Optical Testing Device
Forming tool for forming a contoured microelectronic spring mold
Application:
10/919,151 →
Publication:
US 2005/0016251
Method to Build a Wirebond Probe Card in a Many at a Time Fashion
Wafer-Level Burn-in and Test
Apparatus for Testing Substrates
Test Signal Distribution System for Ic Tester
Method of Designing a Probe Card Apparatus with Desired Compliance Characteristics
Lithographic Contact Elements
Method and Apparatus for Remotely Buffering Test Channels
Contact Structures and Methods for Making Same
Method and Apparatus for Calibrating and/or Deskewing Communications Channels
Probe Holder for Testing of a Test Device
Method of Manufacturing a Resilient Contact
Method for Processing an Integrated Circuit
Compensation for Test Signal Degradation Due to Dut Fault
Adjustable Delay Transmission Lines
Apparatuses and Methods for Cleaning Test Probes
Test Assembly Including a Test Die for Testing a Semiconductor Product Die
Bi-Directional Buffer for Interfacing Test System Channel
Active Wafer Probe
Assembly with a detachable member
Application:
11/021,412 →
Publication:
US 2006/0132153
Probe Head Arrays
Method and Apparatus for Increasing Operating Frequency of a System for Testing Electronic Devices
Guarded Tub Enclosure
Membrane Probing System
Method of Incorporating Interconnect Systems into an Integrated Circuit Process Flow
A Probe Card Assembly Including a Programmable Device to Selectively Route Signals from Channels of a Test System Controller to Probes
Method of Estimating Channel Bandwidth from a Time Domain Reflectometer (Tdr) Measurement Using Rise Time and Maximum Slope
Electromagnetically Coupled Interconnect System Architecture
Probe Card with Coplanar Daughter Card
Process and Apparatus for Adjusting Traces
Method of Manufacturing a Probe Card
Probe Station
Localizing a Temperature of a Device for Testing
Method for Interconnecting an Integrated Circuit Multiple Die Assembly
Method for Making a Socket to Perform Testing on Integrated Circuits
Active diagnostic interface for wafer probe applications
Application:
11/091,069 →
Publication:
US 2006/0214679
Probe Card Cooling Assembly with Direct Cooling of Active Electronic Components
A Test Head Assembly Having Paired Contact Structures
Membrane Probing System
Stacked Die Module
Apparatus and Method for Adjusting an Orientation of Probes
Method and Apparatus for Adjusting a Multi-Substrate Probe Structure
Probe Head Having a Membrane Suspended Probe
Integrated circuit tester with high bandwidth probe assembly
Application:
11/180,247 →
Publication:
US 2011/0115512
Method for Forming Microelectronic Spring Structures on a Substrate
Application:
11/189,954 →
Publication:
US 2006/0019027
Fiducial alignment masks on microelectronic spring contacts
Application:
11/209,221 →
Publication:
US 2006/0066334
Method and System for Compensating Thermally Induced Motion of Probe Cards
Special contact points for accessing internal circuitry of an intergrated circuit
Application:
11/221,231 →
Publication:
US 2006/0006384
Microelectronic Contact Structure
Interconnect Assemblies and Methods
Helical Microelectronic Contact and Method for Fabricating Same
Predictive, Adaptive Power Supply for an Integrated Circuit Under Test
Probe for Semiconductor Devices
Probe Card Covering System and Method
High Performance Probe System
Efficient Wired Interface for Differential Signals
Probe Station Comprising a Bellows with Emi Shielding Capabilities
Probe Cards Employing Probes Having Retaining Portions for Potting in a Retention Arrangement
Voltage Fault Detection and Protection
Probe Card Assembly with an Interchangeable Probe Insert
Three Dimensional Microstructures and Methods for Making Three Dimensional Microstructures
Apparatus and Method for Managing Thermally Induced Motion of a Probe Card Assembly
A Probe Array Structure and a Method of Making a Probe Array Structure
Application:
11/306,574 →
Publication:
US 2007/0152685
Stacked Guard Structures
Device for Testing Thin Elements
Interface for Testing Semiconductors
System for Testing Semiconductors
Layered microelectronic contact and method for fabricating same
Application:
11/362,632 →
Publication:
US 2006/0138677
Photoresist Formulation for High Aspect Ratio Plating
Procedure for Reproduction of a Calibration Position of an Aligned and Afterwards Displaced Calibration Substrate in a Probe Station
Re-assembly process for MEMS structures
Application:
11/374,761 →
Publication:
US 2006/0157839
Probe Structures with Physically Suspended Electronic Components
Extended Probe Tips
Air Bridge Structures and Methods of Making and Using Air Bridge Structures
Method Of Making Microelectronic Spring Contact Array
Application:
11/382,756 →
Publication:
US 2006/0191136
Space Transformers Employing Wire Bonds for Interconnections with Fine Pitch Contacts
Shielded probe for testing a device under test
Methods for Making Plated Through Holes Usable as Interconnection Wire or Probe Attachments
Probe Holder for Testing of a Test Device
Probe for High Frequency Signals
Wideband Active-Passive Differential Signal Probe
Re-Assembly Process for Mems Structures
Adjustable Delay Transmission Line
Method of Expanding Tester Drive and Measurement Capability
Sockets for "Springed" Semiconductor Devices
Application:
11/423,767 →
Publication:
US 2006/0223345
Probe Card Assembly and Kit
Contactor Having a Global Spring Structure and Methods of Making and Using the Contactor
Method of Fabricating Segmented Contactor
Method and System for Compensating Thermally Induced Motion of Probe Cards
Method of Forming an Interconnection Element
Membrane Probing System with Local Contact Scrub
Ac Coupled Parameteric Test Probe
Knee Probe Having Increased Scrub Motion
Sawing Tile Corners on Probe Card Substrates
Microelectronic Contact Structure and Method of Making Same
Wafer-Level Burn-in and Test
Apparatus and Method for Limiting Over Travel in a Probe Card Assembly
Contact Structures Comprising A Core Structure And An Overcoat
Application:
11/461,749 →
Publication:
US 2006/0286828
Adjustment Mechanism
Method and System for Designing a Probe Card
Carbon Nanotube Contact Structures
Method and Apparatus for Making a Determination Relating to Resistance of Probes
Method and Appartus for Switching Tester Resources
Electronic Package with Direct Cooling of Active Electronic Components
Probe Card Configuration for Low Mechanical Flexural Strength Electrical Routing Substrates
Probes with Self-Cleaning Blunt Skates for Contacting Conductive Pads
Low-Current Pogo Probe Card
Adapter for Positioning of Contact Tips
Rhodium Sulfate Production for Rhodium Plating
Application:
11/531,558 →
Publication:
US 2008/0063594
Apparatus and Method of Testing Singulated Dies
High Density Planar Electrical Interface
System for Measuring Signal Path Resistance for an Integrated Circuit Tester Interconnect Structure
Single Support Structure Probe Group with Staggered Mounting Pattern
Method and Apparatus for Indirect Planarization
Probe Station Thermal Chuck with Shielding for Capacitive Current
Method and System for Compensating Thermally Induced Motion of Probe Cards
Electronic Device with Integrated Micromechanical Contacts and Cooling System
Electric Discharge Machining of a Probe Array
Probe Card Assembly with a Mechanically Decoupled Wiring Substrate
Lithographic Type Microelectronic Spring Structures with Improved Contours
Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
Application:
11/552,856 →
Publication:
US 2007/0046313
Methods of Fabricating and Using Shaped Springs
Application:
11/554,485 →
Publication:
US 2007/0054513
Method and Apparatus for Providing Active Compliance in a Probe Card Assembly
Contact Carriers (Tiles) for Populating Larger Substrates with Spring Contacts
Probing Apparatus with Guarded Signal Traces
Sharing Resources in a System for Testing Semiconductor Devices
Probe Cards Employing Probes Having Retaining Portions for Potting in a Potting Region
Electrical Guard Structures for Protecting a Signal Trace from Electrical Interference
Reinforced Contact Elements
Isolation Buffers with Controlled Equal Time Delays
Resilient Contact Element and Methods of Fabrication
Rotating Contact Element and Methods of Fabrication
Stiffener Assembly for Use with Testing Devices
Probing Structure with Fine Pitch Probes
Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance
Inductive Heating of Microelectronic Components
Application:
11/668,975 →
Publication:
US 2007/0119051
Method of Manufacturing A Probe Card
Application:
11/669,010 →
Publication:
US 2007/0126443
Interconnect Assemblies and Methods
Probe Holder for a Probe for Testing Semiconductor Components
Probe Holder for a Probe for Testing Semiconductor Components
Semiconductor Fuse Covering
Application:
11/676,930 →
Publication:
US 2007/0132478
Stiffening Connector and Probe Card Assembly Incorporating Same
Application:
11/690,139 →
Publication:
US 2008/0231258
Electrical Contactor, Espcecially Wafer Level Contactor, Using Fluid Pressure
A Composite Wiring Structure Having a Wiring Block and an Insulating Layer with Electrical Connections to Probes
Testing an Electronic Device Using Test Data from a Plurality of Testers
Composite Motion Probing
Probe For Semiconductor Devices
Application:
11/697,643 →
Publication:
US 2007/0176619
Probe Skates for Electrical Testing of Convex Pad Topologies
Probe for Combined Signals
On-Wafer Test Structures for Differential Signals
Socket for Making with Electronic Component, Particularly Semiconductor Device with Spring Packaging, for Fixturing, Testing, Burning-in or Operating Such a Component
Method of Assembling and Testing an Electronics Module
Apparatuses and Methods for Cleaning Test Probes
Methods of Probing an Electronic Device
Wireless Test System
Method for Processing an Integrated Circuit
Application:
11/749,084 →
Publication:
US 2007/0269909
Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
Application:
11/758,479 →
Publication:
US 2007/0228110
High Performance Probe System
Mechanically Reconfigurable Vertical Tester Interface for Ic Probing
Method for Measurement of a Device Under Test
Photoresist Formulation for High Aspect Ratio Plating
Adjustable Delay Transmission Line
Programmable Devices to Route Signals on Probe Cards
Application:
11/779,145 →
Publication:
US 2007/0261009
Tester Channel to Multiple Ic Terminals
Application:
11/779,163 →
Publication:
US 2008/0010814
Electronic Components with Plurality of Contoured Microelectronic Spring Contacts
Predictive, Adaptive Power Supply for an Integrated Circuit Under Test
Vertical Probe Array Arranged to Provide Space Transformation
Probe Holder for Testing of a Test Device
Guarded Tub Enclosure
Wafer Probe
Probe Station with Low Inductance Path
Probe Station Having Multiple Enclosures
Method to Build Robust Mechanical Structures on Substrate Surfaces
Remote Test Facility with Wireless Interface to Local Test Facilities
Method and Apparatus for Controlling the Temperature of Electronic Components
Methods for Planarizing a Semiconductor Contactor
Bi-Directional Buffer for Interfacing Test System Channel
Method of Repairing a Contactor Apparatus
Stiffener Assembly for Use with Testing Devices
Method and Apparatus for Testing Devices Using Serially Controlled Resources
Component Assembly and Alignment
Reduced Scrub Contact Element
Application:
11/862,172 →
Publication:
US 2009/0079455
Method and Apparatus for Testing Devices Using Serially Controlled Intelligent Switches
Attaching and Interconnecting Dies to a Substrate
Application:
11/863,443 →
Publication:
US 2008/0088030
Apparatus for Testing Devices
Closed-Grid Bus Architecture for Wafer Interconnect Structure
A Probe Card Assembly with Carbon Nanotube Probes Having a Spring Mechanism Therein
Apparatus and Method for Managing Thermally Induced Motion of a Probe Card Assembly
Line-Reflect-Reflect Match Calibration
Membrane Probing System
Probe for Testing a Device Under Test
Membrane Probing System with Local Contact Scrub
Method of Making Lithographic Contact Elements
Probe Support with Shield for the Examination of Test Substrates Under Use of Probe Supports
Probe Station for Testing Semiconductor Substrates and Comprising Emi Shielding
Probe Station and Method for Measurements of Semiconductor Devices Under Defined Atmosphere
Device for Rapidly Changing Objectives with the Aid of Threaded Fastening
Method and Apparatus for Testing Electronic Components Within Horizontal and Vertical Boundary Lines of a Wafer
Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System
Application:
11/960,396 →
Publication:
US 2009/0164931
Method and System for Compensating Thermally Induced Motion of Probe Cards
Probe Station Thermal Chuck with Shielding for Capacitive Current
Vertical Guided Probe Array Providing Sideways Scrub Motion
Chuck for Holding a Device Under Test
Chuck for Holding a Device Under Test
Shielded Probe for Testing a Device Under Test
Shielded Probe for Testing a Device Under Test
Intelligent probe card architecture
Application:
12/001,281 →
Publication:
US 2008/0100320
Membrane Probing System
Probe Cards Employing Probes Having Retaining Portions for Potting in a Retention Arrangement
Contact Tip Structure for Microelectronic Interconnection Elements and Methods of Making Same
Application:
12/020,380 →
Publication:
US 2008/0116927
Method of Making an Interconnect Element for Microelectronic Structures
Application:
12/026,466 →
Publication:
US 2008/0120833
Rhodium Electroplated Structures and Methods of Making Same
Application:
12/026,471 →
Publication:
US 2008/0241482
Method of Making a Socket to Perform Testing on Integrated Circuits and Socket Made
Application:
12/030,037 →
Publication:
US 2008/0132095
High Density Planar Electrical Interface
Method And Apparatus For Designing A Custom Test System
Application:
12/044,600 →
Publication:
US 2009/0224793
Providing an Electrically Conductive Wall Structure Adjacent a Contact Structure of an Electronic Device
Method and Apparatus for Processing Failures During Semiconductor Device Testing
Alignment Features in a Probing Device
Chuck with Triaxial Construction
Wafer-Level Burn-in and Test
Contact Carriers (Tiles) for Populating Larger Substrates with Spring Contacts
Probe Card Assembly and Kit
Probe Head Having a Membrane Suspended Probe
Switch for Use in Microelectromechanical Systems (Mems) and Mems Devices Incorporating Same
Multi-Stage Spring System
Self-Monitoring Switch
Isolation Buffers with Controlled Equal Time Delays
Adjustment Mechanism
Application:
12/116,032 →
Publication:
US 2008/0203268
Spring Interconnect Structures
Method of Designing a Probe Card Apparatus with Desired Compliance Characteristics
Reinforced Contact Elements
Prober for Testing Magnetically Sensitive Components
Pre-Aligner Search
Probe Bonding Method Having Improved Control of Bonding Material
Test Structure and Probe for Differential Signals
Apparatus and Method for Adjusting Thermally Induced Movement of Electro-Mechanical Assemblies
Self-Referencing Voltage Regulator
Wafer Level Interposer
Multilayered Probe Card
A Probe Card Assembly for Electronic Device Testing with Dc Test Resource Sharing.
Thin Wafer Chuck
Configuration of Shared Tester Channels to Avoid Electrical Connections Across Die Area Boundary on a Wafer
Probe Head Controlling Mechanism for Probe Card Assemblies
Application:
12/191,083 →
Publication:
US 2010/0039133
Method and Apparatus for Increasing Operating Frequency of a System for Testing Electronic Devices
Method and Apparatus for Testing Semiconductor Devices with Autonomous Expected Value Generation
Double Sided Probing Structures
Method and Apparatus for Providing a Tester Integrated Circuit for Testing a Semiconductor Device Under Test
Process of Positioning Groups of Contact Structures
Electronic Package with Direct Cooling of Active Electronic Components
Method of Forming an Interconnect Assembly Having a Stop Structure
Application:
12/251,217 →
Publication:
US 2009/0035959
Process and Apparatus for Adjusting Traces
High Performance Probe System
Air Bridge Structures and Methods of Making and Using Air Bridge Structures
Apparatus and Method for Making and Using a Tooling Die
Application:
12/259,915 →
Publication:
US 2010/0104678
Printing of Redistribution Traces on Electronic Component
Probe Card Thermal Conditioning System
Method and Apparatus for Remotely Buffering Test Channels
Increasing Thermal Isolation of a Probe Card Assembly
Electrical Contactor, Especially Wafer Level Contactor, Using Fluid Pressure
Probing Apparatus with Impedance Optimized Interface
Interface for Testing Semiconductors
Method to Build a Wirebond Probe Card in a Many at a Time Fashion
Apparatuses and Methods for Cleaning Test Probes
Application:
12/326,521 →
Publication:
US 2009/0139040
Mechanical Decoupling of a Probe Card Assembly to Improve Thermal Response
Method and Arrangement for Positioning a Probe Card
Electronic Device Testing Using a Probe Tip Having Multiple Contact Features
Contactless Interfacing of Test Signals with a Device Under Test
Microspring Array Having Reduced Pitch Contact Elements
Printed Solar Panel
Application:
12/343,135 →
Publication:
US 2010/0154861
Method and Apparatus for Adjusting a Multi-Substrate Probe Structure
Biased Gap-Closing Actuator
Stiffener Assembly for Use with Testing Devices
Prober for Testing Devices in a Repeat Structure on a Substrate
Apparatus and Method for Limiting Over Travel in a Probe Card Assembly
Application:
12/360,433 →
Publication:
US 2009/0134897
System for Measuring Signal Path Resistance for an Integrated Circuit Tester Interconnect Structure
Probe Array and Method of Its Manufacture
Application:
12/368,531 →
Publication:
US 2009/0139965
Membrane Probing Structure with Laterally Scrubbing Contacts
Method and Apparatus for Making a Determination Relating to Resistance of Probes
Probe Card Assembly with an Interchangeable Probe Insert
Closed-Grid Bus Architecture for Wafer Interconnect Structure
Application:
12/409,690 →
Publication:
US 2009/0179659
Method and Apparatus for Terminating a Test Signal Applied to Multiple Semiconductor Loads Under Test
Carbon Nanotube Contact Structures for Use with Semiconductor Dies and Other Electronic Devices
Application:
12/418,368 →
Publication:
US 2010/0252317
Anchoring Carbon Nanotube Columns
Vertical Probe Array Arranged to Provide Space Transformation
Carbon Nanotube Spring Contact Structures with Mechanical and Electrical Components
Flexure Band and Use Thereof in a Probe Card Assembly
Application:
12/423,927 →
Publication:
US 2010/0264949
Method of Estimating Channel Bandwidth from a Time Domain Reflectometer (Tdr) Measurement
Application:
12/431,037 →
Publication:
US 2009/0212790
Method and Apparatus for Probe Card Alignment in a Test System
Method and Apparatus for Enhanced Probe Card Architecture
Process For Manufacturing Contact Elements For Probe Card Assembles
Application:
12/470,971 →
Publication:
US 2010/0140793
Apparatus and Method for Managing Thermally Induced Motion of a Probe Card Assembly
Application:
12/477,748 →
Publication:
US 2010/0000080
Mechanical Decoupling of a Probe Card Assembly to Improve Thermal Response
Test System with Wireless Communications
Chuck for Supporting and Retaining a Test Substrate and a Calibration Substrate
Method and Apparatus for Thermally Conditioning Probe Cards
Spring Interconnect Structures
Method of Expanding Tester Drive and Measurement Capability
Lithographic Contact Elements
Application:
12/498,886 →
Publication:
US 2010/0088888
Method of Wirebonding That Utilizes a Gas Flow Within a Capillary from Which a Wire Is Played Out
Application:
12/500,495 →
Publication:
US 2010/0065963
Alignment Features in a Probing Device
Microelectronic Contact Structures
Probe Card Assembly and Kit, and Methods of Making Same
Wafer Level Contactor
Method of Repairing Segmented Contactor
Probe Card Cooling Assembly with Direct Cooling of Active Electronic Components
Method and Apparatus for Multilayer Support Substrate
Method and System for Designing a Probe Card
Calibration Substrate
Microelectronic Contact Structure
Test Apparatus for Measuring a Chracteristic of a Device Under Test
Replaceable Coupon for a Probing Apparatus
Voltage Fault Detection and Protection
Application:
12/606,788 →
Publication:
US 2010/0039739
Remote Test Facility with Wireless Interface to Local Test Facilities
Electromagnetically Coupled Interconnect System Architecture
Method for Increasing the Accuracy of the Positioning of a First Object Relative to a Second Object
Carbon Nanotube Columns and Methods of Making and Using Carbon Nanotube Columns as Probes
Space Transformers Employing Wire Bonds for Interconnections with Fine Pitch Contacts
Patent:
44,407 →
Application:
12/646,661 →
System for Testing Semiconductors
Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance
Probe Element Having a Substantially Zero Stiffness and Applications Thereof
Wafer Level Interposer
Application:
12/689,397 →
Publication:
US 2010/0120267
Knee Probe Having Reduced Thickness Section for Control of Scrub Motion
Layered Probes With Core
Vertical Guided Layered Probe
Wiring Substrate with Customization Layers
Closed-Grid Bus Architecture for Wafer Interconnect Structure
Methods for Planarizing a Semiconductor Contactor
Application:
12/766,101 →
Publication:
US 2010/0263432
Temporary Planar Electrical Contact Device and Method Using Vertically-Compressible Nanotube Contact Structures
Probes with Offset Arm and Suspension Structure
Probing Apparatus with Guarded Signal Traces
Electrical Contactor, Especially Wafer Level Contactor, Using Fluid Pressure
Method to Build Robust Mechanical Structures on Substrate Surfaces
Apparatus and Method of Testing Singulated Dies
Probe Station for on-Wafer-Measurement Under Emi-Shielding
Membrane Probing Method Using Improved Contact
Arrangement and Method for Focusing a Multiplane Image Acquisition on a Prober
Sharpened, Oriented Contact Tip Structures
Single Support Structure Probe Group with Staggered Mounting Pattern
Probe Retention Arrangement
Multiple Contact Probes
Probe Skates for Electrical Testing of Convex Pad Topologies
Patent:
43,503 →
Application:
12/903,566 →
Fine Pitch Guided Vertical Probe Array Having Enclosed Probe Flexures
Method and Apparatus for Providing Active Compliance in a Probe Card Assembly
Method of Wirebonding That Utilizes a Gas Flow Within a Capillary from Which a Wire Is Played Out
Attachment of an Electrical Element to an Electronic Device Using a Conductive Material
Probe Card Stiffener with Decoupling
Method of Forming a Probe Substrate by Layering Probe Row Structures and Probe Substrates Formed Thereby
Patent:
8,513,942 →
Application:
12/974,152 →
Wafer Test Cassette System
Fuel Cell Using Carbon Nanotubes
Stiffener Assembly for Use with Testing Devices
A Low Noise Connector with Cables Having a Center, Middle and Outer Conductors
Segmented Contactor
Application:
13/073,585 →
Publication:
US 2011/0171838
Probe Card Assembly Having an Actuator for Bending the Probe Substrate
Prober for Testing Devices in a Repeat Structure on a Substrate
Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance
Vertical Probe Array Arranged to Provide Space Transformation
Method for Verifying a Test Substrate in a Prober Under Defined Thermal Conditions
Method for Testing Electronic Components of a Repetitive Pattern Under Defined Thermal Conditions
Testing Techniques for Through-Device Vias
Method and Apparatus for Testing Devices Using Serially Controlled Intelligent Switches
Chuck for Supporting and Retaining a Test Substrate and a Calibration Substrate
Probe with Cantilevered Beam Having Solid and Hollow Sections
Elastic Encapsulated Carbon Nanotube Based Electrical Contacts
Systems and Methods for Simultaneous Optical Testing of a Plurality of Devices Under Test
Resilient Electrical Interposers, Systems That Include the Interposers, and Methods for Using and Forming the Same
Non-Linear Vertical Leaf Spring
Method for Measurement of a Power Device
Wireless Probe Card Verification System and Method
Probes with High Current Carrying Capability and Laser Machining Methods
Pre-Aligner Search
Probe Head Assemblies, Components Thereof, Test Systems Including the Same, and Methods of Operating the Same
High Frequency Interconnect Structures, Electronic Assemblies That Utilize High Frequency Interconnect Structures, and Methods of Operating the Same
Probes with Offset Arm and Suspension Structure
Probe Bonding Method Having Improved Control of Bonding Material
Focusing Optical Systems and Methods for Testing Semiconductors
Method and Device for Contacting a Row of Contact Areas with Probe Tips
Probes With Spring Mechanisms For Impeding Unwanted Movement In Guide Holes
Hybrid Electrical Contactor
Contactor Devices With Carbon Nanotube Probes Embedded In A Flexible Film And Processes Of Making Such
Method And Apparatus For Designing A Custom Test System
Application:
13/693,338 →
Publication:
US 2013/0096866
Vertical Probe Array Arranged to Provide Space Transformation
High Voltage Chuck for a Probe Station
Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic Devices
Probes With Programmable Motion
Modular Prober and Method for Operating Same
Systems and Methods for Non-Contact Power and Data Transfer in Electronic Devices
Application:
13/822,611 →
Publication:
US 2013/0183898
Wiring Substrate With Filled Vias To Accommodate Custom Terminals
Method for Testing a Test Substrate Under Defined Thermal Conditions and Thermally Conditionable Prober
Probe Fabrication Using Combined Laser and Micro-Fabrication Technologies
Application:
13/963,402 →
Publication:
US 2014/0044985
Vertical Probes for Multi-Pitch Full Grid Contact Array
Application:
13/963,567 →
Publication:
US 2014/0043054
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Systems and Methods for Handling Substrates at Below Dew Point Temperatures
Systems and Methods for Providing Wafer Access in a Wafer Processing System
Method for Verifying a Test Substrate in a Prober Under Defined Thermal Conditions
Probe Card Assembly For Testing Electronic Devices
Automated Attaching and Detaching of an Interchangeable Probe Head
Multipath Electrical Probe and Probe Assemblies with Signal Paths Through Secondary Paths Between Electrically Conductive Guide Plates
Prober for Testing Devices in a Repeat Structure on a Substrate
Probe Retention Arrangement
Resilient Electrical Interposers, Systems That Include the Interposers, and Methods for Using and Forming the Same
Systems and Methods for on-Wafer Dynamic Testing of Electronic Devices
Wafer-Handling End Effectors with Wafer-Contacting Surfaces and Sealing Structures
Multiple Contact Probes
Resilient Electrical Interposers, Systems That Include the Interposers, and Methods for Using and Forming the Same
Probe Head Assemblies, Components Thereof, Test Systems Including the Same, and Methods of Operating the Same
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest in United States Patents and Trademarks
Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Change of Name
Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
Assignment of Assignor's Interest
Sep 1, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 057393/0609 →
Security Interest
Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →