Method and apparatus for thermally conditioning probe cards
View Patent ↗Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.
1. An apparatus for testing a device (DUT), comprising:
a probe card configured for testing a DUT;
a thermal management apparatus disposed on the probe card to heat and/or cool the probe card;
a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card;
a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and
a second connector, different than and electrically insulated from the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester,
wherein the thermal management apparatus includes control means configured to change an operational mode of the thermal management apparatus depending on whether the first connector but not the second connector is receiving power, the second connector but not the first connector is receiving power, or both the first connector and the second connectors are receiving power.
2. The apparatus of claim 1 , wherein the thermal management apparatus comprises:
a device for heating and/or cooling; and
a temperature controller coupled to, and for controlling, the device for heating and/or cooling in response to the data of the sensor.
3. The apparatus of claim 2 , wherein the sensor is integral with the device for heating and/or cooling.
4. The apparatus of claim 2 , further including an indicating device for indicating to the temperature controller whether the first or second connectors are receiving power.
5. The apparatus of claim 1 , further including means for limiting an amount of power drawn through the first connector.
6. The apparatus of claim 1 , wherein the second power source is a battery.
7. The apparatus of claim 1 , wherein the second power source is an AC power outlet.
8. The apparatus of claim 7 , wherein the second power source further comprises: a DC power supply plugged into the AC power outlet.
9. The apparatus of claim 1 , further comprising:
a tester having the probe card installed therein; and
a second power source external to the tester connected to the second connector.
10. The apparatus of claim 9 , wherein the tester further comprises a first power source, and wherein the first power source is connected to the first connector.
11. The apparatus of claim 1 , wherein the control means is configured, when both the first connector and the second connector are receiving power, to cause the thermal management apparatus to draw full power to heat or cool the probe card from the power being received by the second connector.
12. The apparatus of claim 1 , wherein the control means is configured, when both the first connector and the second connector are receiving power, to cause the thermal management apparatus to draw full power to heat or cool the probe card from the power being received by the second connector before drawing power to heat or cool the probe card from the power being received by the first connector.
13. An apparatus for testing a device (DUT), comprising:
a probe card configured for testing a DUT;
a device for heating and/or cooling the probe card;
a temperature controller coupled to, and for controlling, the device for heating and/or cooling the probe card;
a sensor disposed on the probe card and coupled to the temperature controller to provide data to the temperature controller corresponding to a temperature of a location of the probe card;
a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and
a second connector, different than and electrically insulated from the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.