Patent Assignment
Reel/Frame 072263/0272
Security Interest
Recorded: 2025-07-29
Pages: 24
Assignor
FORMFACTOR, INC.
Executed: 2025-07-29
Assignee
WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
P.O. BOX 760776, MAC T7422-012, SAN ANTONIO, TEXAS, 78245
Covered Properties
(278)
Abbreviated Loopback Attenuation
PCT:
PCT/US2023/024424 ↗
Mems Probes Having Decoupled Electrical and Mechanical Design
PCT:
PCT/US2023/085209 ↗
Probe Head Having Vertically Embedded Components in the Printed Circuit Board
PCT:
PCT/US2025/015113 ↗
Flexural Patterns in Guide Plate Substrates
PCT:
PCT/US2025/015116 ↗
Probe Head Having Features to Facilitate Cooling with Liquid-Cooled Heat Exchanger
PCT:
PCT/US2025/024332 ↗
Angled Flying Lead Wire Bonding Process
Patent:
6,295,729 →
Application:
09/164,470 →
Method for Processing an Integrated Circuit Including Placing Dice into a Carrier and Testing
Patent:
6,887,723 →
Application:
09/260,794 →
Interconnect for Microelectronic Structures with Enhanced Spring Characteristics
Shaped Spring
Patent:
7,458,816 →
Application:
09/547,561 →
Method and Apparatus for Sub-Micron Imaging and Probing on Probe Station
Patent:
6,377,066 →
Application:
09/610,668 →
Membrane Probing System
Special Contact Points for Accessing Internal Circuitry of an Integrated Circuit
Lithographic Contact Elements
Wafer Level Interposer
Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via
Electromagnetically Coupled Interconnect System Architecture
Electronic Components with Plurality of Contoured Microelectronic Spring Contacts
Probe Station
Fiducial Alignment Marks on Microelectronic Spring Contacts
Process and Apparatus for Adjusting Traces
Multiple Die Interconnect System
Method and System for Compensating for Thermally Induced Motion of Probe Cards
Probe Card Covering System and Method
Probe Card Cooling Assembly with Direct Cooling of Active Electronic Components
Apparatus and Method for Cleaning Test Probes
Apparatus for Reducing Power Supply Noise in an Integrated Circuit
Substrate-Holding Device for Testing Circuit Arrangements on Substrates
High Performance Probe System
Tester Channel to Multiple Ic Terminals
Method and System for Compensating Thermally Induced Motion of Probe Cards
Interconnection Element with Contact Blade
Test Method for Yielding a Known Good Die
Method and Device to Clean Probes
Microelectronic Contact Structures, and Methods of Making Same
Method for Manufacturing a Multi-Layer Printed Circuit Board
Probe Station Thermal Chuck with Shielding for Capacitive Current
Method for Making a Socket to Perform Testing on Integrated Circuits and Socket Made
Integrated Circuit Assembly
Guarded Tub Enclosure
Microelectronic Contact Structure
Angled Flying Lead Wire Bonding Process
Method of Designing , Fabricating, Testing and Interconnecting an Ic to External Circuit Nodes
Method of Probing a Device Using Captured Image of Probe Structure in Which Probe Tips Comprise Alignment Features
High Performance Probe System
Insulative Covering of Probe Tips
Method of Making an Electronics Module
Apparatus and Method for Electromechanical Testing and Validation of Probe Cards
Probe Station with Low Noise Characteristics
Patent:
6,847,219 →
Application:
10/666,219 →
Probe Station with Low Inductance Path
Test Apparatus with Loading Device
Wireless Test System
Methods for Making Plated Through Holes Usable as Interconnection Wire or Probe Attachments
Integrated Circuit Tester with High Bandwidth Probe Assembly
Spring Interconnect Structures
Contactless Interfacing of Test Signals with a Device Under Test
Probe Testing Structure
Systems and Methods for Wireless Semiconductor Device Testing
Intelligent Probe Card Architecture
Closed-Grid Bus Architecture for Wafer Interconnect Structure
Tester Channel to Multiple Ic Terminals
Probe for Testing a Device Under Test
Freely Deflecting Knee Probe with Controlled Scrub Motion
Apparatuses and Methods for Planarizing a Semiconductor Contactor
Testing Circuits on Substrates
Method and Prober for Contacting a Contact Area with a Contact Tip
Double Acting Spring Probe
Cantilever Probe with Dual Plane Fixture and Probe Apparatus Therewith
Testing Circuits on Substrates
Remote Test Facility with Wireless Interface to Local Test Facilities
Method to Build a Wirebond Probe Card in a Many at a Time Fashion
Apparatus for Testing Substrates
Test Signal Distribution System for Ic Tester
Method for Processing an Integrated Circuit
Compensation for Test Signal Degradation Due to Dut Fault
Method and Apparatus for Maintaining Accurate Positioning Between a Probe and a Dut
Bi-Directional Buffer for Interfacing Test System Channel
Process for Forming Mems
Method and Apparatus for Increasing Operating Frequency of a System for Testing Electronic Devices
Testing Circuits on Substrate
A Probe Card Assembly Including a Programmable Device to Selectively Route Signals from Channels of a Test System Controller to Probes
Electromagnetically Coupled Interconnect System Architecture
Method of Manufacturing a Probe Card
Process for Forming Microstructures
Thermal Optical Chuck
Probe Head Having a Membrane Suspended Probe
Post and Tip Design for a Probe Contact
Torsion Spring Probe Contactor Design
Method and System for Compensating Thermally Induced Motion of Probe Cards
Testing Circuits on Substrates
High Performance Probe System
Probe Station Comprising a Bellows with Emi Shielding Capabilities
Probe Card Assembly with an Interchangeable Probe Insert
Apparatus and Method for Managing Thermally Induced Motion of a Probe Card Assembly
Stacked Guard Structures
Probe Card Assembly
System for Testing Semiconductors
Probe Head with Machined Mounting Pads and Method of Forming Same
Patent:
7,180,316 →
Application:
11/346,954 →
Optically Enhanced Probe Alignment
Space Transformers Employing Wire Bonds for Interconnections with Fine Pitch Contacts
Knee Probe Having Increased Scrub Motion
Probe Card with Balanced Lateral Force
Method and Appartus for Switching Tester Resources
Probes with Self-Cleaning Blunt Skates for Contacting Conductive Pads
Knee Probe Having Reduced Thickness Section for Control of Scrub Motion
Excess Overdrive Detector for Probe Cards
Single Support Structure Probe Group with Staggered Mounting Pattern
Method and System for Compensating Thermally Induced Motion of Probe Cards
Electric Discharge Machining of a Probe Array
Probe Card Assembly with a Mechanically Decoupled Wiring Substrate
Probe Cards Employing Probes Having Retaining Portions for Potting in a Potting Region
Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance
Probe Head with Machine Mounting Pads and Method of Forming Same
Probe Skates for Electrical Testing of Convex Pad Topologies
Hybrid Probe for Testing Semiconductor Devices
Method of Assembling and Testing an Electronics Module
Semicoductor Testing Device with Elastomer Interposer
High Performance Probe System
Method for Measurement of a Device Under Test
Method for Reparing a Microelectromechanical System
Post and Tip Design for a Probe Contact
Apparatus for Testing Devices
Apparatus and Method for Managing Thermally Induced Motion of a Probe Card Assembly
Line-Reflect-Reflect Match Calibration
Probe for Testing a Device Under Test
Method of Forming Probe Card Assembly
Probe Support with Shield for the Examination of Test Substrates Under Use of Probe Supports
Probe Station and Method for Measurements of Semiconductor Devices Under Defined Atmosphere
Planarizing Probe Card
Probe Station Thermal Chuck with Shielding for Capacitive Current
Vertical Guided Probe Array Providing Sideways Scrub Motion
Shielded Probe for Testing a Device Under Test
Torsion Spring Probe Contactor Design
Probe Card Assembly and Method of Forming Same
Probe for Testing Semiconductor Devices with Features That Increase Stress Tolerance
Alignment Features in a Probing Device
Chuck with Triaxial Construction
Probe Card Substrate with Bonded Via
Spring Interconnect Structures
Probe Bonding Method Having Improved Control of Bonding Material
A Probe Card Assembly for Electronic Device Testing with Dc Test Resource Sharing.
Method and Apparatus for Providing a Tester Integrated Circuit for Testing a Semiconductor Device Under Test
Printing of Redistribution Traces on Electronic Component
Increasing Thermal Isolation of a Probe Card Assembly
Electrical Contactor, Especially Wafer Level Contactor, Using Fluid Pressure
Probing Apparatus with Impedance Optimized Interface
Interface for Testing Semiconductors
Thermocentric Alignment of Elements on Parts of an Apparatus
Mechanical Decoupling of a Probe Card Assembly to Improve Thermal Response
Method and Arrangement for Positioning a Probe Card
Contactless Interfacing of Test Signals with a Device Under Test
Probe Card Assembly with an Interchangeable Probe Insert
Method and Apparatus for Terminating a Test Signal Applied to Multiple Semiconductor Loads Under Test
Vertical Probe Array Arranged to Provide Space Transformation
Method and Apparatus for Probe Card Alignment in a Test System
Tissue Stapler with Positioning Mechanism
Mechanical Decoupling of a Probe Card Assembly to Improve Thermal Response
Method and Apparatus for Thermally Conditioning Probe Cards
Replaceable Coupon for a Probing Apparatus
Superfilling Secondary Metallization Process in Mems Fabrication
Multi Material Secondary Metallization Scheme in Mems Fabrication
Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance
Probe for Testing Semiconductor Devices
Knee Probe Having Reduced Thickness Section for Control of Scrub Motion
Layered Probes With Core
Microelectronic Contactor Assembly, Structures Thereof, and Methods of Constructing Same
Probe Head for a Microelectronic Contactor Assembly, the Probe Head Having Smt Electronic Components Thereon
Vertical Guided Layered Probe
Probecard System and Method
Single Support Structure Probe Group with Staggered Mounting Pattern
Multiple Contact Probes
Fine Pitch Guided Vertical Probe Array Having Enclosed Probe Flexures
Attachment of an Electrical Element to an Electronic Device Using a Conductive Material
Probe Card Stiffener with Decoupling
High Density Test Structure Array to Support Addressable High Accuracy 4-Terminal Measurements
Patent:
8,901,951 →
Application:
13/022,435 →
Stiffener Assembly for Use with Testing Devices
A Low Noise Connector with Cables Having a Center, Middle and Outer Conductors
Probe Card Assembly Having an Actuator for Bending the Probe Substrate
Prober for Testing Devices in a Repeat Structure on a Substrate
Vertical Probe Array Arranged to Provide Space Transformation
Method for Verifying a Test Substrate in a Prober Under Defined Thermal Conditions
Method for Testing Electronic Components of a Repetitive Pattern Under Defined Thermal Conditions
Method and Apparatus for Testing Devices Using Serially Controlled Intelligent Switches
Chuck for Supporting and Retaining a Test Substrate and a Calibration Substrate
Probe with Cantilevered Beam Having Solid and Hollow Sections
Systems and Methods for Simultaneous Optical Testing of a Plurality of Devices Under Test
Non-Linear Vertical Leaf Spring
Multi Material Secondary Metallization Scheme in Mems Fabrication
Method for Measurement of a Power Device
Wireless Probe Card Verification System and Method
Probes with High Current Carrying Capability and Laser Machining Methods
Fine Pitch Microelectronic Contact Array and Method of Making Same
Probes with Offset Arm and Suspension Structure
Probe Skates for Electrical Testing of Convex Pad Topologies
Patent:
46,221 →
Application:
13/545,571 →
Probe Bonding Method Having Improved Control of Bonding Material
Focusing Optical Systems and Methods for Testing Semiconductors
Method and Device for Contacting a Row of Contact Areas with Probe Tips
Probes With Spring Mechanisms For Impeding Unwanted Movement In Guide Holes
Vertical Probe Array Arranged to Provide Space Transformation
Fine Pitch Probes for Semiconductor Testing, and a Method to Fabricate and Assemble Same
Fine Pitch Probes for Semiconductor Testing, and a Method to Fabricate and Assemble Same
Transferring Electronic Probe Assemblies to Space Transformers
Modular Prober and Method for Operating Same
Laterally Driven Probes for Semiconductor Testing
Method of Replacing an Existing Contact of a Wafer Probing Assembly
Low Overdrive Probes with High Overdrive Substrate
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Systems and Methods for Handling Substrates at Below Dew Point Temperatures
Systems and Methods for Providing Wafer Access in a Wafer Processing System
Methods to Manufacture Semiconductor Probe Tips
Patent:
9,678,108 →
Application:
14/178,171 →
Probe Card Assembly For Testing Electronic Devices
Automated Attaching and Detaching of an Interchangeable Probe Head
Multipath Electrical Probe and Probe Assemblies with Signal Paths Through Secondary Paths Between Electrically Conductive Guide Plates
Prober for Testing Devices in a Repeat Structure on a Substrate
Probe Retention Arrangement
Systems and Methods for on-Wafer Dynamic Testing of Electronic Devices
Wafer-Handling End Effectors with Wafer-Contacting Surfaces and Sealing Structures
Multiple Contact Probes
Shielded Probe Systems
Probes with Fiducial Marks, Probe Systems Including the Same, and Associated Methods
Test Standards and Methods for Impedance Calibration of a Probe System, and Probe Systems That Include the Test Standards or Utilize the Methods
Shielded Probe Systems with Controlled Testing Environments
Probe Head Assemblies and Probe Systems for Testing Integrated Circuit Devices
Method of Electrically Contacting a Bond Pad of a Device Under Test with a Probe
Probe Systems and Methods for Automatically Maintaining Alignment Between a Probe and a Device Under Test During a Temperature Change
Wiring Substrate With Filled Vias To Accommodate Custom Terminals
Floating Nest for a Test Socket
Methods to Manufacture Semiconductor Probe Tips
Probe Systems, Storage Media, and Methods for Wafer-Level Testing Over Extended Temperature Ranges
Probe Systems and Methods
Shielded Probe Systems with Controlled Testing Environments
Contact Engines, Probe Head Assemblies, Probe Systems, and Associated Methods for on-Wafer Testing of the Wireless Operation of a Device Under Test
LED light source probe card technology for testing CMOS image scan devices
Shielding for Vertical Probe Heads
Probe Systems and Methods Including Electric Contact Detection
Probe Head with Inductance Reducing Structure
Vertical probe array having a tiled membrane space transformer
Probe Systems for Testing a Device Under Test
Direct Metalized Guide Plate
MEMS Probe Card Assembly having Decoupled Electrical and Mechanical Probe connections
Method and device for optically representing electronic semiconductor components
Probes with Fiducial Targets, Probe Systems Including the Same, and Associated Methods
Probe tip with embedded skate
Methods of Controlling the Operation of Probe Stations and Probe Stations That Perform the Methods, the Methods Including Generating and Executing a Test Routine That Directs the Probe Station to Electrically Test a Test Subset of a Plurality of Duts and to Pre-Test a Pre-Test Subset of a Plurality of Duts, Which Is a Subset of the Test Subset, with a Pre-Test
Probe Systems and Methods Including Electric Contact Detection
Electrical test probes having decoupled electrical and mechanical design
Probe Systems and Methods That Utilize a Flow-Regulating Structure for Improved Collection of an Optical Image of a Device Under Test
Probe Systems and Methods
Probe Systems and Methods for Calibrating Capacitive Height Sensing Measurements
Microscopes with Objective Assembly Crash Detection and Methods of Utilizing the Same
Probe on carrier architecture for vertical probe arrays
Calibration Chucks for Optical Probe Systems, Optical Probe Systems Including the Calibration Chucks, and Methods of Utilizing the Optical Probe Systems
Methods for Maintaining Gap Spacing Between an Optical Probe of a Probe System and an Optical Device of a Device Under Test, and Probe Systems That Perform the Methods
Probe Systems for Optically Probing a Device Under Test and Methods of Operating the Probe Systems
Probe Systems and Methods for Characterizing Optical Coupling Between an Optical Probe of a Probe System and a Calibration Structure
Probe Systems and Methods for Testing a Device Under Test
Probe Systems Including Imaging Devices with Objective Lens Isolators, and Related Methods
Double-Sided Probe Systems with Thermal Control Systems and Related Methods
Beamforming Device Testing
Methods of Producing Augmented Probe System Images and Associated Probe Systems
3D electrical integration using component carrier edge connections to a 2D contact array
Multi-Conductor Transmission Line Probe
Probe Systems Configured to Test a Device Under Test and Methods of Operating the Probe Systems
Probe Head Including a Guide Plate with Angled Holes to Determine Probe Flexure Direction
Application:
17/587,898 →
Publication:
US 2022/0236304
Method of centering probe head in mounting frame
Cryogenic Wafer Testing System
Probes That Define Retroreflectors, Probe Systems That Include the Probes, and Methods of Utilizing the Probes
Thermal management techniques for high power integrated circuits operating in dry cryogenic environments
Application:
17/958,102 →
Publication:
US 2023/0108475
Vertical probe array having sliding contacts in elastic guide plate
Single wire serial communication using pulse width modulation in a daisy chain architecture
Application:
18/114,087 →
Publication:
US 2023/0269118
Abbreviated Loopback Attenuation
Application:
18/205,735 →
Publication:
US 2023/0393174
MEMS probes having decoupled electrical and mechanical design
Application:
18/391,228 →
Publication:
US 2024/0201225
Wafer-Handling End Effectors Configured to Selectively Lift a Wafer from an Upper Surface of the Wafer, Probe Systems That Include the Wafer-Handling End Effectors, and Methods of Utilizing the Wafer-Handling End Effectors
Methods of Establishing Contact Between a Probe Tip of a Probe System and a Device Under Test, Probe Systems That Perform the Methods, and Storage Media That Directs Probe Systems to Perform the Methods
Roller Tap Down Technique for Probe Arrays
Application:
18/634,655 →
Publication:
US 2024/0345133
Space Transformers Configured to Be Utilized in a Probe System, Probe Systems That Include the Space Transformers, and Related Methods
Probe head having vertically embedded components in the printed circuit board
Application:
19/048,770 →
Publication:
US 2025/0258196
Flexural Patterns in Guide Plate Substrates
Application:
19/048,773 →
Publication:
US 2025/0258198
Probe head having features to facilitate cooling with liquid-cooled heat exchanger
Application:
19/177,067 →
Publication:
US 2025/0321266
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 17, 2016
From: SIMMONS, MICHAEL E.; BOLT, BRYAN CONRAD; STORM, CHRISTOPHER ANTHONY; NEGISHI, KAZUKI
To: CASCADE MICROTECH, INC.
Reel/Frame 038014/0202 →
Security Interest in United States Patents and Trademarks
Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Change of Name
Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
Assignment of Assignor's Interest
Aug 18, 2021
From: ADVANTEST AMERICA, INC.
To: FORMFACTOR, INC.
Reel/Frame 057219/0246 →
Assignment of Assignor's Interest
Sep 1, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 057393/0609 →
Release of Security Interest
Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →