Method for repairing a microelectromechanical system

1. A method for repairing a damaged probe from a probe card, wherein the probe card comprises a substrate, a plurality of operational probes formed on the substrate and a plurality of replacement probes formed on the substrate, wherein the plurality of operational probes and the plurality of replacement probes are formed in substantially the same manufacturing process, the method comprising the steps of:

(a) identifying the damaged probe;

(b) removing the damaged probe from the probe card;

(c) separating one of the plurality of replacement probes from the substrate; and

(d) installing the one probe separated in step (c) where the damaged probe was removed in step (b).

2. The method of claim 1 wherein the plurality of replacement probes comprises a release layer that is activated by applying a voltage, wherein step (c) of the method further comprises:

(c)(1) applying the voltage to the one probe; and

(c)(2) exposing the one probe to an etching solution.

3. The method of claim 1 wherein method of separation of step (c) is selected from a group consisting of mechanical plucking, mechanical shearing, laser cutting, voltage-activated etching, sacrificial layer etching and combinations thereof.

4. The method of claim 1 wherein step (c) of the method is performed before the probe card is placed into service.

5. The method of claim 1 wherein step (d) of the method is performed using a die bonder.

6. The method of claim 1 wherein the method of removal of step (b) is selected from a group consisting of mechanical plucking, mechanical shearing, laser cutting, voltage-activated etching and combinations thereof.