Patent Assignment
Reel/Frame 022824/0902
Release of Security Interest
Recorded: 2009-06-16
Received: 2009-06-16
Pages: 19
Assignors
3VS1 ASIA GROWTH FUND LTD.
Executed: 2009-06-15
ADAMS CAPITAL MANAGEMENT II, L.P.
Executed: 2009-06-15
ADAMS CAPITAL MANAGEMENT III, L.P.
Executed: 2009-06-15
CHANCELLOR V, L.P.
Executed: 2009-06-15
CHANCELLOR V-A, L.P.
Executed: 2009-06-15
CITIVENTURE 2000, L.P.
Executed: 2009-06-15
E-INVEST LIMITED
Executed: 2009-06-15
FALCON FUND
Executed: 2009-06-15
FIRSTMARK III OFFSHORE PARTNERS, L.P.
Executed: 2009-06-15
FIRSTMARK III, L.P.
Executed: 2009-06-15
FORT WASHINGTON PRIVATE EQUITY INVESTORS IV, L.P.
Executed: 2009-06-15
J.F. SHEA CO., AS NOMINEE 2000-129
Executed: 2009-06-15
KENTUCKY CO-INVESTMENT PARTNERS, L.P.
Executed: 2009-06-15
MERITECH CAPITAL AFFILIATES III L.P.
Executed: 2009-06-15
MERITECH CAPITAL PARTNERS III L.P.
Executed: 2009-06-15
THE ROBERT AND ANNE POCHOWSKI LIVING TRUST DATED MAY 5, 1999
Executed: 2009-06-15
Assignee
TOUCHDOWN TECHNOLOGIES, INC.
5188 COMMERCE DRIVE, BALDWIN PARK, CA, 91706, UNITED STATES
Covered Properties
(35)
Microelectronic Wafer Contactor Assembly and Method of Forming the Same
Application:
61/153,731 →
Probe Card Substrate with Bonded Via
Application:
12/077,627 →
Probe for Testing Semiconductor Devices with Features That Increase Stress Tolerance
Application:
12/042,295 →
Planarizing Probe Card
Application:
11/953,204 →
Probe Card Assembly and Method of Forming Same
Application:
11/986,453 →
Torsion Spring Probe Contactor Design
Application:
11/983,521 →
Method of Forming Probe Card Assembly
Application:
11/901,014 →
Forked Probe for Testing Semiconductor Devices
Application:
11/855,094 →
Method for Reparing a Microelectromechanical System
Application:
11/778,207 →
Semicoductor Testing Device with Elastomer Interposer
Application:
11/754,818 →
Post and Tip Design for a Probe Contact
Application:
11/796,482 →
Hybrid Probe for Testing Semiconductor Devices
Application:
11/734,434 →
System to Optimize a Semiconductor Probe Card
Application:
11/686,768 →
Probe Head with Machine Mounting Pads and Method of Forming Same
Application:
11/641,255 →
Lateral interposer contact design and probe card assembly
Application:
11/633,324 →
Megasonic Cleaning Using Supersaturated Solution
Application:
11/595,029 →
Excess Overdrive Detector for Probe Cards
Application:
11/535,219 →
Probe Card with Balanced Lateral Force
Application:
11/457,132 →
Stacked Contact Bump
Application:
11/421,064 →
Optically Enhanced Probe Alignment
Application:
11/369,343 →
Electronic Tether for Portable Objects
Application:
11/360,061 →
Probe Head with Machined Mounting Pads and Method of Forming Same
Application:
11/346,954 →
Probe Card Assembly
Application:
11/317,408 →
Lateral interposer contact design and probe card assembly
Application:
11/226,568 →
Torsion Spring Probe Contactor Design
Application:
11/194,801 →
Post and Tip Design for a Probe Contact
Application:
11/194,720 →
Animal Training and Tracking System Using Rf Identification Tags
Application:
11/113,088 →
Process for Forming Microstructures
Application:
11/102,982 →
An Electronic Tether for Portable Objects
PCT:
PCTUS2005011540 ↗
Method for Integrating Image Sensor
Application:
11/084,388 →
Image Sensor and Digital Gain Compensation Method Thereof
Application:
11/081,480 →
Process for Forming Mems
Application:
11/019,912 →
Electronic Tether for Portable Objects
Application:
10/911,018 →
Electronic Tether for Portable Objects
Application:
10/832,498 →
Angled Flying Lead Wire Bonding Process
Application:
10/342,167 →